Rotary magnetron sputtering target

Abstract

The invention relates to a rotary magnetic control sputtering target, which comprises a pole terminal, permanent magnets and cylindrical target material, wherein, tree rows of permanent magnets are uniformly arranged in the pole terminal along the circumferential direction towards one side of a matrix within the range of 120 DEG; the permanent magnets comprise long permanent magnetic strips and short permanent magnetic strips; the short permanent magnetic strips are arranged in the middle position of the pole terminal; a long permanent magnetic strip is respectively arranged on both sides of the pole terminal; a shielding case is arranged on the circumference of the cylindrical target material and provided with sputtering openings on one sides of the permanent magnets facing to the matrix; the polarity of the long permanent magnetic strips and that of the short permanent magnetic strips are different; the polarization direction is perpendicular to a central axis of a sputtering cathode; and a closed racetrack shaped magnetic force line is formed by magnetic rings on both ends of the pole terminal and the long permanent magnetic strips and the short permanent magnetic strips. When the rotary magnetic control sputtering target is operated, the cylindrical target material is rotated at a constant speed and the surface etching of the target is uniform, thereby the consumption of the target material is uniform and the service life is long; the shielding case can effectively reduce sputtering precipitation of sputtering particles towards an anode and the wall of a vacuum cavity and satisfactorily guarantee stability of the sputtering process and the quality of a deposition film; the application prospect of the target is good.

Description

technical field [0001] The invention relates to a rotating cylinder magnetron sputtering target for coating, which belongs to the technical field of thin film preparation. Background technique [0002] Magnetron sputtering target is one of the main devices in vacuum coating equipment. Modern photoelectric thin film products need to deposit a large amount of insulating compound films such as oxides and nitrides, so intermediate frequency response magnetron sputtering technology is widely used; now in vacuum coating equipment The main application is the planar magnetron sputtering target, the permanent magnet and the target are both stationary, so the etching area of ​​the target is fixed; therefore, when the planar magnetron sputtering target deposits insulating material films, the utilization rate of the target is very high. Low, usually up to 40%; as the etching of the target becomes deeper and deeper, the sputtering rate of the target and the uniformity of the film will be...

AI Technical Summary

Problems solved by technology

The accumulation of the dielectric film deposited on the inner surface of the vacuum chamber will accumulate the incident positive ion charge, and sparks will be generated to a certain extent, which will generate impurity particles and affect the quality of the film deposited on the substrate; in addition, the spark discharge will also make The sputtering power supply is overloaded instantaneously, resulting in unstable sputtering power supply

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