Calibration method based on thermocouple high-precision heat flow parameter measurement equipment

Abstract

The invention aims to provide the calibration method for the high-precision heat flow parameter measurement equipment based on the thermocouple, so as to improve the measurement precision of the heat flow parameter measurement equipment and ensure the reliability, consistency and stability of the measurement equipment. The high-precision heat flow parameter measuring equipment comprises an upper computer, a Beckhoff controller, a cooling thermotank, a fixed support, two test conduction blocks, two thermocouples, a heating module and a thermoelectric generator. The calibration method of the equipment comprises the following steps of: A, calibrating the two thermocouples; step B, establishing a thermal model, loading two calibration blocks which are made of different materials and are consistent with the tested product in appearance into equipment for measurement to obtain reference data, and calculating calibration parameters according to the reference data, wherein the calibration parameters comprise a proportionality coefficient S for converting the input voltage into the heat flux density, the thermal contact resistance RC of the interface layer of the tested product and the thermal loss QLOSS generated by leakage, and the measurement precision of the equipment is calibrated. The method can be applied to the technical field of measurement and detection.

Description

technical field [0001] The invention relates to the technical field of thermal measurement, in particular to a calibration method for a thermocouple-based high-precision heat flow parameter measurement device. Background technique [0002] At present, many wearable mobile terminals have temperature measurement functions, and those that do very well will have two monitoring functions including peripheral (external) environmental temperature measurement and human body (internal) self-temperature measurement. These two different temperatures are measured by the same module (wearable electronic device) at the same time, so the wearable device must accurately measure the two temperatures separately, and this requires that the two internal thermal sensors do not interact with each other. Affected by thermal conduction, that is, the body temperature of the human body when worn will not affect the ambient temperature sensor, and the relative ambient temperature will not affect the h...

AI Technical Summary

Problems solved by technology

[0004]In general, the laminates of wearable devices are relatively complex, and the laminates contain plastics, semiconductor devices, printed circuit boards, various metals, etc., so the thermal resistance of wearable devices much more complex than a single pure object

Due to the existence of factors such as inherent multilayer stacking and contact thermal resistance (RC) during measurement, and heat loss during measurement (Q_LOSS), only thermal Resistance tester or temperature sensor is difficult to accurately measure the thermal resistance of wearable electronic devices, making it difficult to judge the measurement performance of wearable devices

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