Clamp convenient for thermal resistance test of SMD (Surface Mounted Device) packaged semiconductor device

Abstract

The invention discloses a fixture convenient for thermal resistance test of an SMD packaged semiconductor device, the fixture comprises a protective shell, one end of the top of the inner wall of the protective shell is fixedly connected with an annular plate, the interior of the annular plate is rotatably connected with a test disc, and the surface of the test disc is uniformly provided with three test grooves. By arranging the driving device, automatic feeding and automatic testing of the clamp can be achieved, a complete assembly line is formed for thermal resistance testing of the SMD packaged semiconductor device, the automation degree of the testing process is high, and the convenience and the testing speed of the clamp during thermal resistance testing can be effectively improved; through the arrangement of the matched detection device, the SMD packaged semiconductor device can be automatically pressed at the central part of the surface of the testing device when the fixture performs thermal resistance testing on the SMD packaged semiconductor device, so that the testing device can conveniently perform thermal resistance testing on the SMD packaged semiconductor device, and the use convenience of the fixture can be further improved.

Description

technical field [0001] The invention belongs to the technical field of thermal resistance testing fixtures for SMD packaged semiconductor devices, and in particular relates to a fixture for testing the thermal resistance of SMD packaged semiconductor devices. Background technique [0002] The thermal characteristics of semiconductor devices are one of the important contents in reliability design. In order to ensure the reliability of the device in use, the structural design of the device should consider the heat dissipation characteristics of the device, and the quantitative calculation of these designs needs to be based on the thermal resistance parameters of the device. Therefore, the thermal resistance of a semiconductor device is an important parameter reflecting the thermal characteristics of the device. For semiconductor devices packaged in SMD, the three electrodes are all located on the bottom of the device and on the same plane. Since the part with the higher tempe...

AI Technical Summary

Problems solved by technology

[0003] However, most of the existing fixtures for thermal resistance testing of SMD packaged semiconductor devices are relatively low in automation. , and then remove the SMD-packaged semiconductor device to complete the thermal resistance test of an SMD-packaged semiconductor device. Not only is the operation cumbersome, but the test efficiency is low

Images