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Silicon rod cutting and grinding all-in-one machine and silicon rod cutting and grinding method

An all-in-one machine and silicon rod technology, which is applied in the field of silicon workpiece processing, can solve the problems of poor processing effect and low efficiency of silicon rod processing.

Pending Publication Date: 2022-06-21
TDG NISSIN PRECISION MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to disclose a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method, which are used to solve the inefficiency of each process and the processing of silicon rods in the existing related technologies. Problems such as poor homework performance

Method used

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  • Silicon rod cutting and grinding all-in-one machine and silicon rod cutting and grinding method
  • Silicon rod cutting and grinding all-in-one machine and silicon rod cutting and grinding method
  • Silicon rod cutting and grinding all-in-one machine and silicon rod cutting and grinding method

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Embodiment Construction

[0052] The embodiments of the present application are described below by specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0053] In the following description, reference is made to the accompanying drawings, which describe several embodiments of the present application. It is to be understood that other embodiments may be utilized and mechanical, structural, electrical, as well as operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered limiting, and the scope of embodiments of the present application is limited only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. Spatially related terms, such as "upper," "lower," "...

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Abstract

The invention discloses a silicon rod cutting and grinding all-in-one machine and a silicon rod cutting and grinding method.The silicon rod cutting and grinding all-in-one machine comprises a cutting device and a grinding device, the cutting device comprises a first cutting unit, a first distance adjusting unit, a second cutting unit and a second distance adjusting unit, and the first cutting unit comprises two orthogonal first cutting wire saws; the second cutting unit comprises two orthogonal second cutting fretsaws, and the cutting positions of the two orthogonal first cutting fretsaws are adjusted through the first distance adjusting unit so as to adjust the cutting space formed by the two orthogonal first cutting fretsaws. And the second distance adjusting unit is used for adjusting the cutting positions of the two orthogonal second cutting fretsaws so as to adjust the cutting space formed by the two orthogonal second cutting fretsaws, so that based on the silicon rod cutting and grinding all-in-one machine, the integrated operation of multiple processes of squaring and grinding of the silicon rod can be completed, the production efficiency and the quality of product processing operation are improved, and the production cost is reduced. And cutting spaces formed by the cutting wire saws can be adjusted to adapt to silicon rods with different specifications and sizes.

Description

technical field [0001] The present application relates to the technical field of silicon workpiece processing, in particular to a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. Background technique [0002] At present, with the attention and opening of the society to the utilization of green and renewable energy, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, common crystalline silicon solar cells are fabricated on high-quality silicon wafers, which are cut and subsequently processed by a multi-wire saw from a pulled or cast silicon ingot. [0003] The existing manufacturing process of silicon wafers, taking monocrystalline silicon products as an example, generally, the rough operation process can include: first, use a silicon rod cutting machine to cut off the original long silicon rods to form multi-section short silicon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00B28D5/04B24B9/06B24B27/00B24B41/04B24B41/06
CPCB28D5/045B28D5/0058B28D5/0082B24B27/0076B24B41/06B28D5/0064B24B41/005B24B27/0023B24B27/0069B24B5/50B24B5/04Y02P70/50
Inventor 卢建伟钱春军潘雪明曹奇峰
Owner TDG NISSIN PRECISION MACHINERY CO LTD
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