Preparation method, grinding device and detection method of SRP sample

Abstract

The invention provides a preparation method, a grinding device and a detection method of an SRP sample, and relates to the technical field of semiconductor preparation. During preparation of the SRP sample, a plurality of initial SRP samples of the same type are firstly selected; then determining an SRP sample area needing to be prepared according to a preset abrasive sheet specification, and determining a splicing scheme of an initial SRP sample according to the SRP sample area; fixing the initial SRP sample on a silicon wafer substrate according to the splicing scheme, and covering the initial SRP sample with cover glass to obtain an intermediate SRP sample; and finally, the middle SRP sample is placed in a grinding device meeting the preset grinding sheet specification to be ground, and the SRP sample meeting the preset grinding sheet specification is obtained. According to the method, samples of the same kind are spliced to complete preparation of the SRP sample when the SRP sample of the small specification is adopted, so that the sample preparation area of the SRP sample is increased, the spliced SRP sample has enough needle feeding distance, and the detection effect is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor preparation, in particular to a preparation method, a grinding device and a detection method of an SRP sample. Background technique [0002] SRP (Spreading resistance profile, spread resistance profile) test is a method of measuring the diffusion resistance, resistivity, carrier concentration distribution and other electrical parameters of semiconductor materials with high resolution. widely used. The SRP test obtains data through the contact measurement of two probes on the inclined section of the sample, and can quickly obtain the distribution curves of carrier concentration, resistivity and electroactive impurity density with depth. [0003] With the improvement of semiconductor technology, the integration of SRP samples is also getting higher and higher. In the small-area SRP analysis, due to the inability to grind the sample, the measurable area of ​​the sample is small, which leads to...

AI Technical Summary

Problems solved by technology

[0003] With the improvement of semiconductor technology, the integration of SRP samples is getting higher and higher. In the small-area SRP analysis, the measurable area of ​​the sample is small due to the reason that it cannot be ground, which leads to the limitation of the needle distance and poor detection effect.

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