Polymer sandwich structure with enhanced thermal conductivity and method of making same
A technology of polymers and structures, applied in chemical instruments and methods, synthetic resin layered products, coatings, etc., can solve problems such as cost
Pending Publication Date: 2022-06-24
GM GLOBAL TECH OPERATIONS LLC
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[0003] One of the challenges with this type of approach is that the heat from the heated mold takes a certain amount of time to travel from the surface in contact with the heated cavity through the thickness of the prepreg to the cavity of the prepreg that is not connected to the heated cavity. the other side of contact
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[0073] Referring now to the drawings (in which like reference numerals refer to like parts throughout the several views), shown and described herein is a polymeric interlayer structure 10 having enhanced thermal conductivity, and use in making the polymeric interlayer structure 10. Various configurations and methods 100, 300, 400 of system / process equipment 101, 301, 401 including core layer 24 and outer layer 29 of polymer sandwich structure 10.
[0074] figure 1 One embodiment of a polymer sandwich structure 10 with enhanced thermal conductivity is shown. The polymer sandwich structure 10 includes a first layer 12 formed of a first polymer matrix 14 and including a first fiber reinforced sheet 16 embedded within the first polymer matrix 14, formed of a second polymer matrix 20 and including an embedded The second layer 18 of the second fiber-reinforced sheet 22 within the second polymer matrix 20, and the third layer 24 disposed between the first layer 12 and the second lay...
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Abstract
Polymeric sandwich structures having enhanced thermal conductivity and methods of making the same are disclosed. The invention relates to a polymer sandwich structure with enhanced thermal conductivity. The present invention relates to a composite comprising a first layer formed from a first polymer matrix and comprising a first fiber-reinforced sheet embedded within the first polymer matrix, a second layer formed from a second polymer matrix and comprising a second fiber-reinforced sheet embedded within the second polymer matrix, and a third layer disposed between the first layer and the second layer, the third layer is formed from a third polymer matrix having graphene nanosheets dispersed therein. Each of the first fiber-reinforced sheet and the second fiber-reinforced sheet is made of reinforcing fibers and includes a respective set of staggered discontinuous perforations formed therein, wherein a respective set of each interleaved discontinuous perforation defines a respective first plurality of reinforcing fibers having a respective first length and a respective second plurality of reinforcing fibers having a respective second length that is longer than the respective first length.
Description
technical field [0001] The present disclosure generally relates to polymer sandwich structures having enhanced thermal conductivity, and methods of making polymer sandwich structures having enhanced thermal conductivity. Background technique [0002] Composite materials can be used to form a wide variety of components, such as structural members, covers, and the like. Commonly used composite materials include thermoset resin matrices with strips or segments of reinforcing material such as carbon or glass fibers embedded therein, or thermoplastic polymers with chopped fibers embedded therein. For example, so-called "prepregs" are commonly used in compression molding to form parts, wherein a prepreg is a sheet, strip, fabric or segment of reinforcement material coated and absorbed with a thermoset resin, which is placed in a heated mold cavity And use the plug to mold. [0003] One of the challenges with this type of approach is that it takes a certain amount of time for the...
Claims
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IPC IPC(8): B32B27/18B32B27/20B32B3/24B32B27/34B32B27/30B32B27/24B32B33/00B29D7/01
CPCB32B27/18B32B27/20B32B3/266B32B27/34B32B27/302B32B27/24B32B33/00B29D7/01B32B2262/106B32B2262/101B32B2262/0261B32B2262/10B32B2307/302B29C43/52C08J5/24B29B15/127C08J2300/24B32B2260/046B32B2250/40B32B5/02B32B5/26B32B2262/0269B32B2260/023B32B2264/10B32B2307/212B32B2250/20B32B2264/101B29C43/003B29K2105/06B29K2105/16B29K2105/12B29K2105/08B32B27/12B32B2264/2032B32B38/04B32B37/06B32B2260/021B32B2264/108B32B2250/04B32B2038/047B32B2264/201
Inventor S·X·赵黄晓松
Owner GM GLOBAL TECH OPERATIONS LLC