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Digital isolator element

A digital isolator and component technology, applied in the circuit field, can solve the problems of high chip cost, large chip area, and low substrate utilization rate of digital isolator components.

Pending Publication Date: 2022-06-24
SILERGY SEMICON TECH (HANGZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The substrate utilization rate of existing digital isolator components is not high, and the chip area is large, resulting in high chip cost

Method used

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Embodiment Construction

[0027] The present invention is described below based on examples, but the present invention is not limited to these examples only. In the following detailed description of the invention, some specific details are described in detail. The present invention can be fully understood by those skilled in the art without the description of these detailed parts. Well-known methods, procedures, procedures, components and circuits have not been described in detail in order to avoid obscuring the essence of the present invention.

[0028] Furthermore, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

[0029] Meanwhile, it should be understood that in the following description, "circuit" refers to a conductive loop formed by at least one element or sub-circuit through electrical connection or electromagnetic connection. When an element or circuit is referred to as being "connected"...

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Abstract

The embodiment of the invention discloses a digital isolator element. The digital isolator element comprises a first chip and a second chip electrically connected with the first chip. Wherein the first chip comprises a first substrate, a first circuit formed on the first substrate, an electromagnetic shielding structure covering the first circuit, and an isolation transmission structure arranged on the electromagnetic shielding structure; the second chip includes a second substrate separated from the first substrate and a second circuit formed on the second substrate. The first circuit is one of a coding circuit and a decoding circuit, the second circuit is the other one of the coding circuit and the decoding circuit, and the isolation transmission structure is used for transmitting coding signals in an electrical isolation mode. According to the digital isolator element, on the premise that the performance of a digital isolator is not affected, the utilization rate of a substrate is improved, the chip area is reduced, and the chip cost is reduced.

Description

technical field [0001] The invention relates to the technical field of circuits, in particular to a digital isolator element. Background technique [0002] Digital isolator is a device that has high resistance isolation characteristics when digital signals and analog signals are transmitted in electronic systems to achieve isolation between electronic systems and users. isolation and capacitive isolation. The substrate utilization rate of the existing digital isolator element is not high, and the chip area is large, resulting in high chip cost. SUMMARY OF THE INVENTION [0003] In view of this, the embodiment of the present invention provides a digital isolator element, so as to improve the utilization rate of the substrate, reduce the chip area, and reduce the chip cost without affecting the performance of the digital isolator. [0004] In a first aspect, an embodiment of the present invention provides a digital isolator element, where the digital isolator element inclu...

Claims

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Application Information

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IPC IPC(8): H01L23/552
CPCH01L23/552H01F27/2804H01F19/06H01F27/363H02M1/4258H02M3/33515H02M3/33523
Inventor 黄晓冬董玉斐赵晨
Owner SILERGY SEMICON TECH (HANGZHOU) CO LTD
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