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Semiconductor drying device and method

A drying device and drying method technology, applied in the direction of drying gas arrangement, semiconductor/solid-state device manufacturing, local stirring dryer, etc., can solve the problem of surface tension reduction, achieve the effect of reducing surface tension, improving quality, and improving drying capacity

Pending Publication Date: 2022-06-28
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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  • Description
  • Claims
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Problems solved by technology

Currently, the most widely used drying method of IPA (Isopropyl Alcohol) can only be used to 70 degrees due to the boiling point, and the reduction of surface tension has reached the limit

Method used

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  • Semiconductor drying device and method

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Embodiment Construction

[0026] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood, however, that these descriptions are exemplary only, and are not intended to limit the scope of the present disclosure. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concepts of the present disclosure.

[0027] Various structural schematic diagrams according to embodiments of the present disclosure are shown in the accompanying drawings. The figures are not to scale, some details have been exaggerated for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the figures, as well as their relative sizes and positional relationships are only exemplary, and in practice, there may be deviations due to manufacturing tolerances or technical limitations, and those skilled in the art should Regions / la...

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Abstract

The invention provides a semiconductor drying device. The semiconductor drying device comprises a closed cavity; the rotary bracket is arranged in the closed cavity and is used for supporting a wafer to be dried and driving the wafer to be dried to rotate; the gas supply module is communicated with the closed cavity through a pipeline and is used for inputting gas into the closed cavity, so that the gas pressure in the closed cavity is increased; and the heater is arranged in the closed cavity and is used for providing heat for the wafer or the gas in the closed cavity so as to enable the temperature of the wafer or the gas to rise. The temperature in the drying process can be increased, and the surface tension is further reduced.

Description

technical field [0001] The present invention relates to the technical field of semiconductor drying, and in particular, to a semiconductor drying device and method. Background technique [0002] The higher the integration level of the product, the more limited the wafer drying capacity, and poor drying will lead to yield and product characteristics problems. In order to improve drying capacity, various methods are currently used to reduce the surface tension of materials. IPA (Isopropyl Alcohol), the most used drying method at present, can only be used up to 70 degrees due to the boiling point problem, and the reduction of surface tension has reached the limit. SUMMARY OF THE INVENTION [0003] The semiconductor drying device and method provided by the present invention can increase the temperature in the drying process and further reduce the surface tension. [0004] In a first aspect, a semiconductor drying device is provided, comprising: [0005] closed cavity; [0...

Claims

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Application Information

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IPC IPC(8): F26B9/06F26B21/14F26B21/10H01L21/67
CPCF26B9/06F26B21/14F26B21/10H01L21/67109
Inventor 刘钟埈胡艳鹏李琳卢一泓
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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