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Wafer ring taking and mounting device and wafer ring taking and mounting method

A technology of wafer ring and material sticking, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., and can solve the problems of low labor efficiency and high cost

Pending Publication Date: 2022-06-28
JIANGSU COWAIN AUTOMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing technology, manual placement is usually used, which is easy to increase the defect rate of products, and the labor efficiency is low and the cost is high. Based on this, it is necessary to design a corresponding fast placement equipment to solve the problem of fast placement of wafer rings

Method used

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  • Wafer ring taking and mounting device and wafer ring taking and mounting method
  • Wafer ring taking and mounting device and wafer ring taking and mounting method
  • Wafer ring taking and mounting device and wafer ring taking and mounting method

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Embodiment Construction

[0074] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0075] The present invention will be described in further detail below in conjunction with the accompanying drawings. figure 1 The coordinate indications in determine the directions of the X-axis, Y-axis and Z-axis mentioned in the present invention.

[0076] like Figures 1 to 5 As shown, a wafer ring pick-and-place device includes:

[0077] a material storage assembly 34 for placing the wafer ring 21;

[0078] The front-stage reclaiming mechanism 36 is used to take out the wafer ring 21 in the material storage assembly 34 and transfer it to the transfer reclaiming station;

[0079] The rear-stage reclaiming mechanism 37 is used to transfer the wafer ring 21 transferred by the front-stage reclaiming mechanism 36 on the transfer reclaiming station to the placement station;

[0080] Mounting component 35, the mounting component 35 has a mounting work part ...

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Abstract

The invention provides a wafer ring taking and mounting device and a wafer ring taking and mounting method. The wafer ring taking and mounting device comprises a material storage assembly, a front-section taking mechanism, a rear-section taking mechanism and a mounting assembly. The technical effects of the scheme are that the material storage assembly can stack a plurality of wafer rings, the wafer rings can be conveniently taken out one by one, automation can be realized, and the feeding efficiency can be improved. The front-section material taking mechanism is arranged to take out the wafer rings in the material storage assembly, the wafer rings are transferred to the transfer material taking station for the first time, and then the wafer rings on the front-section material taking mechanism are transferred for the second time through the rear-section material taking mechanism; the technical problem that in the prior art, wafer rings in a material storage assembly are difficult to directly convey to a surface mounting station through a material taking mechanism is solved, the technical problem is effectively solved by arranging two material taking mechanisms, and the material taking mechanism has the advantages of being high in transfer efficiency and high in adaptability. And by adopting a mechanical transfer mode, the transfer precision is effectively improved, so that the position of the wafer ring is more accurate, and the mounting precision of the wafer ring can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor production and processing, in particular to a wafer ring picking and mounting device and a wafer ring picking and mounting method. Background technique [0002] Wafer or wafer ring is the raw material for the production of chips and LEDs and other devices. After multiple chips or LEDs are fabricated on the wafer, these chips or LEDs need to be separated from the wafer one by one. After that, the MiniLEDs need to be separated from the wafer one by one and mounted on the glass panel. In the prior art, manual mounting is usually used, which is easy to increase the defect rate of products, and the labor efficiency is low and the cost is high. Based on this, it is necessary to design a rapid mounting equipment to solve the problem of rapid mounting of wafer rings. . SUMMARY OF THE INVENTION [0003] In order to solve the above-mentioned technical problems, the present invention discloses a wa...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/50H01L21/58H01L33/00
CPCH01L21/67144H01L21/50H01L33/0093H01L33/0095
Inventor 段徽庆韩鹏周永斌曹乃桃
Owner JIANGSU COWAIN AUTOMATION TECH
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