Quick bearing device for high-pressure occasion

Abstract

The invention discloses a quick bearing device for a high-pressure occasion, which comprises a base, a side pushing assembly, a sliding lower seat, a support, a sliding upper seat and a sliding supporting assembly, and the base is horizontally arranged; the sliding lower seat is horizontally arranged on the base in a sliding manner; the side pushing assembly is arranged on one side of the base and connected with the sliding lower base. The number of the supports is two, and the two supports are vertically arranged on the two sides of the base in parallel. The sliding upper seat is arranged between the two supports and connected to the supports in a sliding mode in the vertical direction. The sliding supporting assembly is arranged on the upper portion of the sliding lower base and the lower portion of the sliding upper base. The sliding supporting assembly is connected with the sliding lower base and the sliding upper base. When the sliding lower base slides horizontally, horizontal thrust is converted into jacking force through the sliding supporting assembly. Automatic jacking, supporting and limiting effects on the bottom die are achieved through transverse thrust, the high bearing function is achieved, the equipment structure is simplified, the bottom die replacement action is reduced, and the replacement efficiency is improved.

Description

technical field [0001] The invention relates to the field of automation, in particular to a rapid type carrying device for high pressure occasions. Background technique [0002] The core hardware of the 5G base station is the substrate. The substrate is used as a PCB board, which involves the installation of various electronic parts in the production and assembly process. A common way of installing parts is crimping, that is, the substrate is transferred through a dedicated crimping device. After positioning, the parts are crimped to the base plate with an applied downforce. During the crimping process, the substrate to be crimped is placed on the bottom mold, supported by the bottom mold and fixed in position. In the actual processing of the substrate, there are the following problems: In the crimping process, it involves the replacement of the bottom mold, so as to realize the pressure Loading and unloading of connected and non-crimped substrates; the bottom mold needs to...

AI Technical Summary

Problems solved by technology

During the crimping process, the substrate to be crimped is placed on the bottom mold, supported and fixed by the bottom mold. In the actual processing of the substrate, there are the following problems: the replacement of the bottom mold is involved in the crimping, in order to realize the pressed The loading and unloading of the connected and unpressed substrates; when the bottom mold is replaced, the bottom mold needs to be lifted upwards. The traditional replacement method is to vertically set the cylinder with the output end facing upwards at the bottom of the bottom mold, and use the cylinder to lift the bottom mold; but During the crimping process of the substrate, the crimping force reaches more than 3 tons, and the bottom mold needs to be supported after being pushed up. If the upward supporting force is simply provided by the cylinder, it cannot meet the subsequent crimping force requirements, and it is very easy to get out of the cylinder; therefore, it is necessary to use Insert the inclined block horizontally to the lower part of the bottom mold, and support the bottom mold through the inclined block to avoid direct force on the cylinder; this kind of bottom mold replacement method needs three actions to complete, namely: push the cylinder up, insert the inclined block, and lower the cylinder to make the bottom mold close to the oblique block

This method requires the assistance of multiple mechanisms to complete the replacement of the bottom mold, and there are many actions, the replacement of the bottom mold takes a long time, and the replacement efficiency of the bottom mold is low; in addition, the replacement of the bottom mold by multiple mechanisms and multiple actions also leads to low replacement stability and accuracy

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