High-speed chip mounter with negative pressure cooling device
A technology of cooling device and placement machine, which is applied in transportation and packaging, assembly of printed circuits with electrical components, cooling/ventilation/heating transformation, etc. It can solve problems such as reducing the working efficiency of the placement machine and rising the temperature of the placement machine. To achieve the effect of improving heat dissipation, accelerating air flow and facilitating discharge
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[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0029] see Figure 1-8, the present invention provides a technical solution: a high-speed placement machine with a negative pressure cooling device, comprising a body 1, a side part of the body 1 is provided with a negative pressure cooling mechanism 2, and the negative pressure cooling mechanism 2 comprises a long The cover frame 21, a dustproof member 4 is provided at the output port of the long cover frame 21, and the dustproof me...
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