High-speed chip mounter with negative pressure cooling device

A technology of cooling device and placement machine, which is applied in transportation and packaging, assembly of printed circuits with electrical components, cooling/ventilation/heating transformation, etc. It can solve problems such as reducing the working efficiency of the placement machine and rising the temperature of the placement machine. To achieve the effect of improving heat dissipation, accelerating air flow and facilitating discharge

Inactive Publication Date: 2022-07-12
湖北科来达电子科技有限公司
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a high-speed placement machine with a negative pressure cooling device, which solves the long-time placement work of the existing high-speed placement machine, which will cause the internal temperature of the placement machine to rise. To ensure the stable operation of the placement machine, it is necessary to stop the placement machine regularly, which reduces the working efficiency of the placement machine

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-speed chip mounter with negative pressure cooling device
  • High-speed chip mounter with negative pressure cooling device
  • High-speed chip mounter with negative pressure cooling device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0029] see Figure 1-8, the present invention provides a technical solution: a high-speed placement machine with a negative pressure cooling device, comprising a body 1, a side part of the body 1 is provided with a negative pressure cooling mechanism 2, and the negative pressure cooling mechanism 2 comprises a long The cover frame 21, a dustproof member 4 is provided at the output port of the long cover frame 21, and the dustproof me...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a high-speed chip mounter with a negative pressure cooling device, the high-speed chip mounter comprises a machine body, the side part of the machine body is provided with a negative pressure cooling mechanism, the negative pressure cooling mechanism comprises a long cover frame, and the side wall of the machine body is provided with a cooling component mounting groove. According to the high-speed chip mounter with the negative pressure cooling device, a micro motor drives a gear to rotate, so that an annular fan frame drives fan blades to rotate, the fan blades carry out negative pressure air suction cooling on the interior of a machine body, meanwhile, the micro motor carries out speed reduction treatment through a speed reduction assembly, a centrifugal disc rotates slowly, and when the centrifugal disc and a limiting strip rotate, the centrifugal disc and the limiting strip are not prone to falling off. The axial center end of the centrifugal disc pushes the long cover frame fixedly connected with the cover frame rotating component to swing up and down in a reciprocating mode with the bearing as the circle, and therefore the suction opening of the long cover frame swings up and down, air flowing in the machine body is accelerated, hot air can be discharged conveniently, linkage performance is high, and the heat discharging effect in the machine body is improved.

Description

technical field [0001] The invention relates to the technical field of placement machines, in particular to a high-speed placement machine with a negative pressure cooling device. Background technique [0002] Mounter, also known as "mounting machine", in the production line, it is configured after the glue dispenser or screen printing machine, it is a device that accurately places the mounting components on the PCB pads by moving the mounting head . The placement machine mainly includes the host, the work head assembly, the vision system, the feeding platform, the shaft structure, the transport rail parts, the suction nozzle station, the air source parts, and the input and operation parts. Among them, the feeding platform also includes a stepping feeding device and a tray receiving bracket. [0003] The Chinese invention patent with the announcement number CN103489990B discloses a high-speed LED placement machine, which includes a body and a controller, the controller is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34H05K7/20B01D46/88
CPCH05K3/3431H05K7/20136H05K7/20145H05K7/20172
Inventor 杨能薛进超李扣英朱杰金
Owner 湖北科来达电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products