Method for processing diamond microgroove heat sink through ultraviolet nanosecond laser

Abstract

The invention discloses a method for processing a diamond microgroove heat sink by ultraviolet nanosecond laser, which comprises the following steps of: 1, configuring an ultraviolet nanosecond laser processing system, starting up, preheating and debugging, and calibrating a laser focus; 2, positioning the workpiece, and enabling the coordinate system of the workpiece to coincide with the original point of the laser scanning coordinate system; thirdly, the light beam is positioned, and the Rayleigh length of the laser is exactly embedded into the upper surface of the workpiece; fourthly, an online observation microscope is arranged and is perpendicular to the side face of the workpiece, and the machining morphology is monitored in real time; 5, processing the test according to the minimum topological structure; 6, the machining of the minimum topological structure is regulated and controlled, and finish machining of the minimum topological structure is completed; and step 7, placing a sample piece blank, configuring paraxial observation, processing a sample piece according to the same parameters of the minimum topological structure, observing and processing the sample piece in real time, and observing in real time. Through the steps, the problems of large taper and low precision of diamond microgroove processing in the prior art are solved.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a method for processing a diamond micro-groove heat sink by an ultraviolet nanosecond laser. Background technique [0002] Chip cooling technology is critical to the stability and reliability of electronic products. The use of micro-grooved heat sinks can effectively dissipate heat from electronic product chips. Among the many heat sink materials, diamond has the highest thermal conductivity and the highest heat transfer efficiency. Micro-grooved heat sink machined with diamond can achieve 300W / cm 2 The heat dissipation capability of the above heat flux density greatly improves the reliability of the electronic chip and greatly improves the workload of the electronic chip, making it applicable to more demanding scenarios. The strength of diamond is 8600MPa, which is extremely high, and can withstand the high-pressure working conditions of the heat sink flu...

AI Technical Summary

Problems solved by technology

[0003] The existing laser processing micro-groove technology has the problem of taper in the micro-groove section and the large roughness of the bottom of the micro-groove, which is not suitable for processing heat sink micro-grooves with high precision requirements. A complete and applicable solution for laser-free processing of diamond microgroove heat sink samples

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