Vapor chamber and electronic component
A technology of vapor chamber and partition, which is applied in cooling/ventilation/heating transformation, lighting and heating equipment, indirect heat exchangers, etc. It can solve the problems of easy wrinkling and large thickness of the temperature chamber, and prevent wrinkling , increase the contact area, and achieve the effect of ultra-thin
Pending Publication Date: 2022-07-15
大连保税区金宝至电子有限公司
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Problems solved by technology
[0004] However, in the above technical solution, the thickness of the vapor chamber is relatively large and it is easy to wrinkle
Method used
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[0057] In the related art, the temperature equalizing plate includes a lower casing, a wire mesh plate, a sintering plate and an upper casing which are arranged in sequence. The lower casing is provided with a steam chamber, a plurality of support columns distributed in an array in the steam chamber, and the plurality of support columns are recessed on the edge of the lower casing. The wire mesh plate is erected and welded on the support column, the sintered plate is erected on the wire mesh plate, and both the wire mesh plate and the sintered plate are embedded in the steam chamber. The edge of the lower shell is buckled and welded with the edge of the upper shell, so that the steam chamber forms a closed cavity.
[0058] When in use, the lower casing acts as an evaporating end and is arranged adjacent to the heat dissipation surface of the heating element, and the upper casing acts as a condensing end in contact with the cooling source. The condensate is injected into the e...
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Abstract
The invention relates to a vapor chamber and an electronic component, the vapor chamber is suitable for the electronic component with a heating element, the vapor chamber comprises an evaporation plate and a condensation plate, the evaporation plate and the condensation plate are both parallel to a heating surface, the evaporation plate is located on one side, close to the heating surface, of the condensation plate, and the evaporation plate is welded to the condensation plate; the surface of the side, close to the condensation plate, of the evaporation plate is provided with an evaporation area and a liquid storage area, the evaporation area of the evaporation plate is provided with an evaporation micro-channel, and the liquid storage area of the evaporation plate is provided with a liquid storage micro-channel; the evaporation micro-channels are communicated with the liquid storage micro-channels, the cross sectional area of the evaporation micro-channels is smaller than that of the liquid storage micro-channels, and evaporation cavity ribs are formed between the adjacent micro-channels on the evaporation plate; the surface of the side, close to the evaporation plate, of the condensation plate is provided with a condensation area. The condensation area of the condensation plate is provided with a condensation cavity and a condensation cavity support. The condensation cavity communicates with the evaporation micro-channel and the liquid storage micro-channel, and the condensation cavity is supported and welded to the evaporation cavity ribs. The thin film is small in thickness, ultrathin and capable of preventing wrinkling.
Description
technical field [0001] The present application relates to the technical field of electronic components, and in particular, to a vapor chamber and an electronic component. Background technique [0002] A heat pipe is a component that utilizes the latent heat of vaporization to improve the heat transfer capability of a heat dissipation system by means of a liquid phase change process. It has been widely used in the field of electronic engineering. [0003] In the related art, a vapor chamber (also called vapor chamber or vapor chamber, Vapor Chamber in English, VC for short) is a heat pipe structure that conducts liquid phase change heat transfer in a planar chamber. The temperature equalizing plate includes a lower casing, a wire mesh plate, a sintering plate and an upper casing which are arranged in sequence. The lower shell is provided with a steam chamber, and the wire mesh plate and the sintering plate are embedded in the steam chamber. The edge of the lower shell and t...
Claims
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IPC IPC(8): F28D15/02H05K7/20
CPCF28D15/0233F28D15/025H05K7/20336
Inventor 杨洪武
Owner 大连保税区金宝至电子有限公司