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IGBT module test platform

A module test and test bench technology, applied in vibration test, machine/structural component test, measuring device, etc., can solve problems such as disconnection of connection points, affecting the connection part of IGBT module, affecting the reliability and service life of IGBT module, etc. , to achieve the effect of simple structure and real test results

Pending Publication Date: 2022-07-15
深圳市芯愚公半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the IGBT module is used in automobiles, rail transit and other scenarios, it often encounters continuous vibration, and the continuous vibration will affect the internal connection part of the IGBT module, disconnect the connection point, and then affect the reliability and service life of the IGBT module

Method used

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Embodiment Construction

[0033] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0034] As described in the background art, there are deficiencies in the prior art. In order to solve the above technical problems, the present application proposes an IGBT module test platform.

[0035] see Figure 1-7 , an IGBT module test platform, including a simulation platform 1, a transport component 2, a testing mechanism 3, and a fixture component 4; the simulation platform 1 includes a vibration mechanism 11, and the vibrati...

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Abstract

The invention relates to the technical field of IGBT module testing, in particular to an IGBT module testing platform which is characterized in that an IGBT module is fixed to a vibration mechanism through a jig assembly, the vibration environment of the IGBT module during working is simulated through the vibration mechanism, and after vibration for a set time length, the IGBT module is taken out from the jig assembly at the vibration mechanism through a material taking clamp. The IGBT module is conveyed to the jig assembly through the moving mechanism to be fixed, the IGBT module at the jig assembly is detected through the testing mechanism, the vibration working environment of the IGBT module can be effectively simulated through the vibration mechanism, the vibrated IGBT module can be detected through a tester of the testing mechanism, and the testing result is real and reliable.

Description

technical field [0001] The invention relates to the technical field of IGBT module testing, in particular to an IGBT module testing platform. Background technique [0002] IGBT module packaging is to integrate multiple IGBTs together to improve the service life and reliability of the IGBT module. The IGBT module has three connection parts: the aluminum wire bonding point on the silicon wafer, the welding surface between the silicon wafer and the ceramic insulating substrate, and the welding surface between the ceramic insulating substrate and the copper base plate. When the IGBT module is used in automobiles, rail transit and other scenarios, it often encounters continuous vibration, and the continuous vibration will affect the internal connection part of the IGBT module, causing the connection point to be disconnected, thereby affecting the reliability and service life of the IGBT module. Therefore, it is necessary to set up a test platform to test the influence of various...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01M7/02
CPCG01M7/025G01M7/022G01M7/027
Inventor 向晟
Owner 深圳市芯愚公半导体有限公司
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