Transfer method of LED chip and display panel

A technology of LED chip and transfer method, which is applied in the manufacture of semiconductor devices, electrical components, semiconductor/solid-state devices, etc., can solve the problems of low transfer efficiency, low yield rate, and virtual soldering, and achieve improved yield rate, reduced ratio of virtual soldering, Effect of Improving Transfer Efficiency

Pending Publication Date: 2022-07-29
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Embodiments of the present invention provide a method for transferring LED chips and a display panel, so as to solve the technical problems of a large proportion of false soldering in the existing method for transferring LED chips, and low transfer efficiency and yield.

Method used

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  • Transfer method of LED chip and display panel
  • Transfer method of LED chip and display panel
  • Transfer method of LED chip and display panel

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Embodiment Construction

[0043] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, but not to limit the present invention. In the present invention, unless otherwise stated, the directional words such as "upper" and "lower" generally refer to the upper and lower parts of the device in actual use or working state, specifically the direction of the drawing in the accompanying drawings....

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PUM

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Abstract

The invention discloses an LED chip transfer method and a display panel, and the method comprises the steps: providing a positioning substrate, arranging a stripping glue layer on the positioning substrate, transferring the same type of LED chips on a carrier substrate through the stripping glue layer, and enabling the LED chips to adhere to the positioning substrate; then forming a pressure adhesive film layer on the stripping adhesive layer and the LED chip, and forming a press-fit integrated structure by the pressure adhesive film layer and the LED chip through a mold pressing process; according to the LED packaging structure, the LED chips and the metal bonding pads are bonded and welded, then the stripping adhesive layer is stripped off, the press-fit integrated structure is correspondingly attached to the driving substrate, and the LED chips and the corresponding metal bonding pads are bonded and welded through the mold pressing technology, so that accurate positioning of the LED chips can be achieved, and the yield can be improved; different positioning substrates can be adopted to accurately position and sort various different types / same type of LED chips at the same time, and then the LED chips are transferred to the same driving substrate, so that the transfer efficiency can be improved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a method for transferring LED chips and a display panel. Background technique [0002] Micro-light emitting diode (Micro-LED) chips or mini light-emitting diode chips (Mini-light-emitting diode, Mini-LED) are transferred and welded to the driving substrate through a mass transfer process, and the entire mass transfer of the LED chip is carried out. In the soldering process, multiple transfers are involved, including first peeling the LED chips from the growth substrate and transferring them to a transfer substrate, and then transferring the LED chips to the driving substrate by reflow soldering through the transfer substrate. However, during the reflow soldering process , Due to the small size and light weight of the LED chip, the LED is prone to floating, resulting in a large proportion of virtual welding, and the transfer efficiency and yield are low. SUMMARY OF THE ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L21/683H01L21/68H01L25/075
CPCH01L33/005H01L21/68H01L21/6835H01L25/0753H01L2221/68368
Inventor 赵明深
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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