Electronic packaging BGA solder ball welding method and device based on electromagnetic pulse heating

Abstract

The invention discloses an electronic packaging BGA solder ball welding method and device based on electromagnetic pulse heating, and relates to the technical field of electronic packaging welding, and the device comprises a material collecting pipe, a material level detection head, a base plate, a material distributing piece, a rotating shaft, a welding nozzle seat, an electromagnetic pulse heating device and a cooling device. According to the invention, a plurality of solder balls can be sequentially overlapped and arranged from top to bottom, then switching between blanking and material blocking is realized through rotation of the material distribution sheet, only one solder ball can easily fall into a welding nozzle each time, the tin amount of each welding operation is ensured to be the same, and the BGA packaging uniformity is extremely good; during welding, redundant soldering flux gas and heat at a welding part can be discharged to the outside, so that the internal pressure of the packaging structure is reduced, and the reliability of the packaging structure can be improved; the electric pulse heating device is adopted for heating, the cost is low, the heat efficiency is high, the feeding channel wall is rapidly heated when receiving magnetic field induction current, the electromagnetic oscillation frequency is only 20-30 Hz, and the safety is good.

Description

technical field [0001] The present invention relates to the technical field of electronic package welding, and in particular, to a method and device for electronic package BGA solder ball welding based on electromagnetic pulse heating. Background technique [0002] With the rapid development of the semiconductor industry, the BGA ball array package (Ball Grid Array Package) package structure is widely used in the semiconductor industry. Solder balls are an important industrial raw material for the packaging and connection of electronic components. They are widely used in the electronics industry, manufacturing, automobile manufacturing, and maintenance industries. They exist in various BGA structures and provide a reference for the study of soldering materials. . At present, most solder balls are melted by laser heating, but the price of laser heating equipment is high. Some use the resistance wire heating method, which is more accurate in temperature control, less environ...

AI Technical Summary

Problems solved by technology

At present, solder ball welding mostly adopts laser heating and melting, but the price of laser heating equipment is high

Some use the resistance wire heating method, which is more accurate in temperature control, less environmental pollution, and does not need to consider fuel storage. However, resistance wire winding is used to heat both sides (inner and outer circles), and the inner part (near the cylinder part) is passed into the cylinder. Part of the external heat is lost to the air, resulting in waste of electrical energy

Er5 The ambient temperature rises, and the ambient temperature has a great impact on the production environment. Especially in summer, the working temperature usually exceeds 45 degrees Celsius. Enterprises must lower the temperature through air conditioning, resulting in waste of secondary energy. Moreover, the heating device has a short service life and requires more maintenance. Due to the use of resistance wires for heating, the resistance wires are prone to high-temperature aging, and the service life of ordinary electric heating coils is about half a year, so the maintenance workload is very large

In addition, due to the lack of effective excess soldering gas and heat discharge structure in the current process of solder ball welding, either the solder joints suffer from excessive heat loss and low air pressure, resulting in unreliable soldering, or the solder joints suffer from excessive heat. Too high air pressure leads to unreliable welding

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