Scribing machine

A dicing machine and Y-axis technology, applied in the direction of working accessories, electrical components, manufacturing tools, etc., can solve the problems of cutting accuracy deviation, achieve the effect of stable dimensional accuracy, improve cutting accuracy, and ensure accuracy

Pending Publication Date: 2022-08-05
沈阳和研科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a dicing machine to solve the problem that the existing dicing machine is prone to deviations in cutting accuracy during the cutting process

Method used

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Embodiment Construction

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] It will be understood by those skilled in the art that unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It should also be understood that terms, such as those defined in a general dictionary, should be understood to have meanings consistent with their meanings in the context of the prior art and, unless specifically defined as herein, should not be inter...

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PUM

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Abstract

The invention relates to the technical field of semiconductor cutting, and provides a scribing machine which comprises a main base structure, an X-axis structure and a Y-axis structure. The main base structure comprises a first mounting area and a second mounting area which are arranged at an interval; the part, located in the first installation area, of the main base structure extends upwards to form a protruding structure used for bearing the X-axis structure. The X-axis structure comprises an X-axis guide rail and a cutting workbench, and the X-axis guide rail is detachably connected with the protruding structure. The Y-axis structure comprises a Y-axis base, and a cutting main shaft in sliding fit with the Y-axis base is arranged on the Y-axis base. The Y-axis base is detachably connected with the main base structure located in the second installation area. Through the integrated design of the protruding structure used for bearing the X-axis guide rail and the main base structure, under the overload formed by temperature stress, residual stress is promoted to relax, so that the dimensional accuracy is stable, the aging process of the same base part in the same environment is effectively controlled, and the dimensional accuracy is more stable.

Description

technical field [0001] The invention relates to the technical field of semiconductor cutting, in particular to a dicing machine. Background technique [0002] In the semiconductor device manufacturing process, each semiconductor chip is manufactured by cutting the semiconductor wafer along pre-prepared dividing lines by a dicing machine to form corresponding circuit regions. [0003] During the use of the dicing machine, the staff often finds that the dicing lanes when cutting chips cannot guarantee the micron-level accuracy, and sometimes micron-level accuracy deviations occur, thus affecting the cutting accuracy of the workpiece. SUMMARY OF THE INVENTION [0004] The purpose of the present invention is to provide a dicing machine, so as to solve the problem that the existing dicing machine is prone to deviation of cutting precision during cutting and use. [0005] The invention provides a dicing machine, comprising: a main base structure, an X-axis structure and a Y-axi...

Claims

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Application Information

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IPC IPC(8): B28D5/04B28D7/00H01L21/78
CPCB28D5/0011B28D5/0058H01L21/78
Inventor 张明明石文韩严庆徐双双刘苏阳
Owner 沈阳和研科技有限公司
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