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Signal test method for integrated circuit chips

An integrated circuit and signal detection technology, which is applied in the direction of electronic circuit testing, circuits, electrical components, etc., can solve the problems of overall system performance reduction, misjudgment as logic "1, misjudgment, etc., to save time and manpower, and solve grounding problems. Effects of Bounce Noise and Power Supply Bounce Noise

Inactive Publication Date: 2005-04-20
VIA TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Taking an 8-bit signal as an example, if the least significant bit (LSB) is logic "0", when the other signals switch from logic "1" to logic "0" at the same time, that is, the signal changes from "11111110" to "00000000" In an instant, the potential of the ground pin of the IC chip changes due to parasitic inductance, causing the ground potential of the IC chip to generate bouncing noise, such as figure 1 As shown, if the rebound voltage is too large, it is likely that the receiving end will misjudge the least significant bit as a logic "1"; When it reaches logic "1", that is, the moment the signal changes from "10000000" to "11111111", the power supply pin of the IC chip causes a potential change due to parasitic inductance, which causes the power supply potential of the IC chip to generate bouncing noise, such as figure 2 As shown, if the sinking voltage is too large, it is likely that the receiving end will misjudge the most significant bit as a logic "0"
If such an error occurs, the slightest case will only reduce the overall performance of the system, but this will make the system unstable and cause crashes

Method used

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  • Signal test method for integrated circuit chips
  • Signal test method for integrated circuit chips
  • Signal test method for integrated circuit chips

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Embodiment Construction

[0019] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, a preferred embodiment is specifically cited below, and in conjunction with the accompanying drawings, the detailed description is as follows:

[0020] The present invention utilizes a known and fixed test sample (test pattern) to make the IC chip on the transmitting and receiving end produce an output switching effect on its pins and the signal lines connected therebetween, so as to detect whether there is ground bounce and power supply Bounce noise issue. If the IC chip at the receiving end makes an error in its judgment, it will automatically adjust the reference voltage level to change the judgment level of the digital logic; Output timing so as to avoid the timing when noise occurs.

[0021] According to the present invention, the IC chips on the transmitting and receiving ends are all built-in or generate a plurality of test samples by ...

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Abstract

A signal detection method suitable for integrated circuit chips, wherein the first integrated circuit chip is responsible for sending a plurality of test samples to detect the second integrated circuit chip. According to the present invention, the first integrated circuit chip outputs a different test sample at a time, and the second integrated circuit chip sequentially receives and latches the output test samples to obtain received data, and then according to the received data and output test samples, the second integrated circuit chip The circuit chip can determine whether the received data is correct; if the received data is incorrect and there is at least one error bit, the second integrated circuit chip will refer to the test type of the test sample and indicate that the signal line corresponding to the error bit has ground bounce noise or Interference problem with power supply bouncing noise.

Description

technical field [0001] The invention relates to the field of integrated circuit design, in particular to a method for automatically detecting and fine-tuning the signal quality of an integrated circuit. Background technique [0002] With the advancement of the semiconductor manufacturing process, the operating frequency of the current integrated circuit (IC) chip has been greatly increased compared with the past. Not only that, but the data width it handles has also grown from multiples of 8 bits in the early days to 64, Even 128 bits, although the overall performance of the system can be improved, IC designers, circuit system engineers, circuit layout personnel and printed circuit board (Printed CjrcuitBoard, PCB) manufacturers are also facing more severe challenges. As the speed and density of IC chips become faster and higher, the prevention and control of Electromagnetic Interference (EMI) in the overall circuit system becomes increasingly important. [0003] In high-sp...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28H01L21/66H01L21/82H01L27/00
Inventor 林益明刘贞男
Owner VIA TECH INC