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Electronic device with cooling structure and TV. video game machine having controlling structure

An electronic device and heat dissipation structure technology, which is applied in the field of video game machines, can solve the problems of too large plane size, increase user burden, and users step on it, and achieve excellent performance-cost ratio, good heat dissipation effect, and reduce plane shape Effect

Inactive Publication Date: 2005-06-08
NINTENDO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the electronic device is a home video game machine, it is used near the home TV video player, and many of them are used on the ground. At this time, the size of the plane shape is too large to cause trouble. easy to be stepped on by users
Once the thin video game machine is stepped on by the user, not only the shell is damaged, but also various internal parts are often damaged. For example, the damaged part is an expensive optical or information reading device or a printed circuit board with a CPU. Then the repair fee is very expensive, which increases the user's burden.

Method used

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  • Electronic device with cooling structure and TV. video game machine having controlling structure
  • Electronic device with cooling structure and TV. video game machine having controlling structure
  • Electronic device with cooling structure and TV. video game machine having controlling structure

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Embodiment Construction

[0028] The embodiment described below is an example of an electronic device with a heat dissipation structure, that is, it is applicable to the occasion of a video game machine (video game machine) for home use, and the device applicable to the technical purpose of the present invention is not limited to the video game machine. It should be noted here that it can also be applied to various electronic devices such as computers and DVD players incorporating CPUs, image processing devices, and the like.

[0029] figure 1 It is a perspective view of a video game console as an example of an electronic device having a heat dissipation structure according to an embodiment of the present invention, viewed from the upper front. figure 2It is a perspective view seen from the front and the right side of the video game console. image 3 It is a perspective view seen from the back and bottom of the video game console. The following reference Figure 1-Figure 3 The outline of the struc...

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PUM

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Abstract

By arranging suction holes and exhaust holes on the side of the casing, an air flow channel is formed in the space where the air flows on the connection line between the suction holes and the exhaust holes, and at least one of the suction holes and the exhaust holes and the heat dissipation member are formed. A cooling fan is arranged between one end face of the cooling fin, and the heat emitted from the cooling fins is discharged to the outside with the flowing air, so that the heat generated by the semiconductor element is discharged to the outside of the casing, which can provide a heat dissipation structure with low price and good heat dissipation effect. electronic device.

Description

technical field [0001] The present invention relates to an electronic device with a heat dissipation structure and a video game machine with a heat dissipation structure, especially to an electronic device such as a personal computer with a built-in central processing unit (CPU), a video game machine for home use, and a DVD player. Electronic devices with heat dissipation structures and video game machines with heat dissipation structures that can effectively discharge the heat generated by semiconductor elements during digital processing operations such as image processing to prevent thermal damage to semiconductor elements. Background technique [0002] Electronic devices such as personal computers (referred to as computers), home video game consoles (video game consoles), and DVD players contain printed circuits that contain semiconductor components such as central processing units (CPUs) and image processors that can perform high-speed processing. board, it is necessary ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20A63F9/24G06F1/20
CPCA63F9/24A63F2300/20G06F1/20H05K7/20
Inventor 永田秀夫高本纯治堀祐治
Owner NINTENDO CO LTD