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Method for producing of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows

A connection structure and energy flow technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, semiconductor/solid-state device manufacturing, etc., can solve problems such as electrical conduction and connection units that are difficult to connect

Inactive Publication Date: 2005-07-20
迈克罗泰克微技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the trend of continuous miniaturization, these conductive and connection units are difficult to connect

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The object of the invention is solved by using a structurally layered construction. Layered construction methods are known from microtechnology. For example, DE-PS 44 20 996 describes a method in which a small amount of photohardenable plastic is held by means of surface tension between two plates parallel to each other, at least one of which is transparent to electromagnetic waves. The surface of the plastic solid beneath the electromagnetic wave-permeable plate is hardened, for example by means of a laser beam, on which the surface is aligned in proportion to the dimensions of the 3-dimensional layer model of the structure to be produced which is stored in a connected computer The laser beam is controlled. The laser will harden the plastic fluid layer by layer according to the 3-dimensional layer model, where the distance between the two plates always increases by the thickness of one layer each time, so that the new plastic material is under its surface tension As ...

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PUM

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Abstract

The invention relates to a method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows. Various light-setting materials are used for the production of the layers. Upon exchanging the materials, those layer regions in which no setting occurred during the preceding setting process, are also filled with new material, such that, in the subsequent setting process, not only is the upper layer linked to the one lying directly beneath it, but also material of the upper layer is connected to the material of a layer lying below the penultimate layer. It is thus possible, within the layer sequence, to connect a structure with varying properties from layer to layer.

Description

technical field [0001] The invention relates to a method for the manufacture of electrically conducting and connecting structures for the three-dimensional arrangement of volumes and energy flows. The volume flow can be gaseous, liquid or solid or consist of a mixture of all these states. The energy flow may have acoustic, electrical, magnetic, or electromagnetic properties. Background technique [0002] Today this volumetric and energy flow is often achieved by many different techniques. For microsystem technology, conductor strips and bonding wires are the most commonly used transmission paths. For the transmission of electromagnetic energy, glass fibers are used in addition to waveguides. The volume flow can be achieved through channels, hoses and tubular conductors. Under the trend of continuous miniaturization, these conductive and connecting units are difficult to connect. Contents of the invention [0003] In order to overcome the above-mentioned drawbacks, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/268B01J4/00B29C67/00G03F7/00H01L23/538H01P3/12H01P11/00H05K1/09H05K3/00H05K3/02H05K3/46
CPCH05K2203/0568H05K3/4697H05K1/095H05K3/0023G03F7/0035B29L2031/3061B29L2011/0075H05K3/465H05K3/4664H05K1/0272B29C67/0066H05K3/02B29C64/135B81B7/00
Inventor 赖纳·格岑
Owner 迈克罗泰克微技术有限公司