Method for producing of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
A connection structure and energy flow technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, semiconductor/solid-state device manufacturing, etc., can solve problems such as electrical conduction and connection units that are difficult to connect
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[0016] The object of the invention is solved by using a structurally layered construction. Layered construction methods are known from microtechnology. For example, DE-PS 44 20 996 describes a method in which a small amount of photohardenable plastic is held by means of surface tension between two plates parallel to each other, at least one of which is transparent to electromagnetic waves. The surface of the plastic solid beneath the electromagnetic wave-permeable plate is hardened, for example by means of a laser beam, on which the surface is aligned in proportion to the dimensions of the 3-dimensional layer model of the structure to be produced which is stored in a connected computer The laser beam is controlled. The laser will harden the plastic fluid layer by layer according to the 3-dimensional layer model, where the distance between the two plates always increases by the thickness of one layer each time, so that the new plastic material is under its surface tension As ...
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