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High-frequency device

A technology of high-frequency and inductive components, which is applied in the direction of circuit devices, support structure installation, and circuit layout on support structures, etc. It can solve problems such as inability to load components, and achieve the effects of easy assembly, easy management, and stable performance

Inactive Publication Date: 2006-03-29
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in such a conventional high-frequency device, in order to prevent the coupling between the coil 3 and the inductance element 3b provided on another circuit, the spacer 5 is formed over substantially the entire width of the frame body 4a. Part cannot be loaded on position

Method used

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Examples

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Embodiment Construction

[0029] Hereinafter, this embodiment will be described using the drawings. figure 1 It is a side sectional view of the high-frequency device of this embodiment, FIG. 2 is a plan view thereof, FIG. 3 is a developed view of the sealed case, and FIG. 4 is a detailed view of its main part.

[0030] figure 1 In FIG. 2 , the electronic component 21 is mounted on one surface 20 a of the printed circuit board 20 , and the electronic component 21 and the printed circuit board 20 are connected by solder 22 . In addition, a coil 23 or a coil 23 a as an inductance element is mounted on the other surface 20 b of the printed circuit board 20 . The legs 24 of the coil 23 are penetrated into holes provided in the printed circuit board 20 and connected to the printed circuit board 20 by solder 22 . In this way, a high-frequency circuit on which the electronic components 21 and the coil 23 are preloaded is formed on the printed circuit board 20 .

[0031] The printed circuit board 20 on whi...

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PUM

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Abstract

A radio frequency apparatus comprising a printed circuit board 20 mounting an electronic component 21 including a coil 23 as an inductance element, a metal frame body 26 covering this printed circuit board 20 and connected to the ground, a lid 27 formed integrally with the frame body 26 , covering the inductance element 23 mounting side of the frame body 26, and a leg 28 formed by cutting and bending from the lid 27 , having a width nearly same as the width of the coil 23 , in which the leg 28 is disposed closely to the coil 23.

Description

technical field [0001] The present invention relates to high-frequency devices formed from electronic circuits including inductive elements. Background technique [0002] Next, a conventional high-frequency device will be described with reference to the drawings. Figure 5 It is a side cross-sectional view of a conventional high-frequency device. Image 6 Is its top view, and Figure 7 is a top view of its sealed box. [0003] exist Figure 5 - In FIG. 7, the electronic component 2 is mounted on one surface 1a of the printed circuit board 1, and the electronic component 2 and the printed circuit board 1 are connected with solder. In addition, the coil 3 is mounted on the other surface 1 b of the printed circuit board 1 . The legs 3a of the coil 3 are inserted into the holes provided on the printed substrate 1, and connected to the printed substrate 1 by soldering. The printed circuit board 1 on which the electronic component 2 or the coil 3 is preliminarily mounted is fitt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/02H05K7/02H05K9/00H05K7/14H01L23/02H05K1/02H05K1/18
CPCH05K1/0218H05K2201/10371H05K2201/1003H05K9/0037H05K9/0039H05K1/18
Inventor 中辻幸治山田宏之浅野弘雅铃木正教寺尾笃人
Owner PANASONIC CORP