Welding method between electric components
An electronic component and welding method technology, applied in the field of welding between electronic components, can solve the problems of difficult control of the size of the solder ball, soldering between the solder ball and the circuit board, virtual soldering, etc., and achieve the effect of avoiding short circuit and high welding strength.
Inactive Publication Date: 2006-05-03
DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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Problems solved by technology
This method has three disadvantages. One is that the solder ball presses the solder paste before soldering after installation, causing the solder paste to move around and cause the adjacent solder paste to contact and short circuit; the other is that the electronic components press the tin liquid during soldering, which may also cause a short circuit; The third is that the size of the solder balls is difficult to control, which may cause some solder balls to be welded to the circuit board, resulting in virtual soldering and affecting the normal performance of electronic components.
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[0014] see figure 2 , 3 As shown, the first electronic component 10 of the present invention is provided with a first conductive gasket 12 on it, and several padding devices are provided at appropriate positions near the edge, such as bumps 16 or other similar structures; the second electronic component 20 , the upper surface corresponds to the first conductive gasket 12 is provided with a second conductive gasket 22, and the second conductive gasket 22 is provided with a fusible element 30 (such as solder paste), when the two electronic components 10, 20 are combined together, The first conductive gasket 12 can be adjacent to or lightly contact the fusible element 30 , and then the two electronic elements can be welded and fixedly connected by heating. Compared with the prior art, due to the existence of the pad bump 16, the occurrence of a short circuit between electronic components can be avoided by this welding method. At the same time, when the fusible element 30 is in ...
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A welding method between electronic components, which is used to fix the first electronic component and the second electronic component by welding, is characterized in that: the two electronic components are provided with conductive gaskets at corresponding positions, wherein at least one A bump is provided, and a fusible element is provided on the conductive gasket of at least one electronic component, and then the fusible element is welded to the two conductive gaskets by heating to fix the two electronic components together. This welding method can avoid The occurrence of short circuit between electronic components can also ensure high welding strength.
Description
【Technical field】 [0001] The invention relates to a welding method between electronic components, in particular to a welding method between electronic components which achieves welding through fusible components. 【Background technique】 [0002] For prior art related to this case, please refer to figure 1 As shown, the electronic component 1 and the circuit board 2 are fixed by welding. The electronic component 1 includes a body 3 and a number of solder balls 4 accommodated thereon, and the circuit board 2 is provided with a conductive gasket ( not shown), during assembly, first coat a layer of solder paste 5 on the conductive gasket on the circuit board 2, then install the electronic component 1 on the circuit board 2 for positioning, and then heat it through a heating furnace to make the solder ball 4 Solder and fix the electronic component 1 and the circuit board 2 after melting with the solder paste 5 . This method has three disadvantages. One is that the solder ball pr...
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IPC IPC(8): H05K3/34
Inventor 朱德祥
Owner DEYI PRECISION ELECTRONIC IND CO LTD PANYU