Method and device for cleaning depositinon jet head

Abstract

The present invention relates to a method and equipment for cleaning the deposition ejection head, which can be applied to a chemical vapor deposition machine for semiconductors. The outer cover of the deposition ejection head and the dust particles on its surface are removed by vacuuming the machine; The outer cover of the ejection head and the deposition ejection head are removed from the machine table, and the dust particles on the surface of the area where the deposition ejection head is loaded on the machine table are removed; the deposition ejection head is immersed in a chemical reaction tank for ultrasonic vibration ; Immerse the deposition ejection head in the overflowing water tank, and monitor the water resistance value; immerse the deposition ejection head in the isopropanol tank of reflow; then dry the deposition ejection head with the drying system; to complete the cleaning of the deposition ejection head program of.

Description

technical field [0001] The present invention relates to a method and equipment for cleaning a deposition ejection head, in particular to a method and equipment for cleaning a deposition ejection head applied to a semiconductor chemical vapor deposition machine. Background technique [0002] With the advancement of science and technology, the semiconductor industry is booming today, and the yield and quality of each process have a decisive influence on the semiconductor industry. Especially for the maintenance of semiconductor machines, if it takes too much time or causes damage to its own parts, it will reduce the semiconductor production efficiency or lower the yield rate of its process. Among them, the deposition head (dispersion head) in the chemical vapor deposition (Chemical Vapor Deposition) machine is to make the material to be deposited uniformly deposited on the chip, but after every production time, the impurities caused by the deposition head itself ( There are m...

AI Technical Summary

Problems solved by technology

[0005] 1. Increase the probability of damage to the partition and reduce the yield of the process;

[0006] 2. It is very troublesome and time-consuming to disassemble the partition, which reduces the production efficiency; and

[0007] 3. The deposition ejection head is a main part that needs to be replaced frequently, which increases the production cost

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