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Lead frame moisture barrier for molded plastic electronic packages

A technology of wires and plastic casings, used in electrical components, electrical solid devices, circuits, etc.

Inactive Publication Date: 2002-04-10
RJR POLYMERS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The difficulty with this approach is the demanding nature of the electrical connections that must be made between the wires and the die

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0040] The following are examples of adhesive formulations representing thermoset formulations, thermoplastic formulations, and various combinations of the two.

[0041] 1. Epoxy thermosetting adhesive:

[0042] Component Parts (weight)

[0043] EPON828 25

[0044] EPON1001F 50

[0045] Dicy CG1400 (cyanoguanidine) 5

[0046] Talc 5

[0047] Titanium dioxide 5

[0048] Cab-O-Sil® M5 (fumed silica) 10

[0049] 2. Phenoxy thermoplastic adhesive

[0050] Component Parts (weight)

[0051] Phenoxy PKHJ 95

[0052] Talc powder 3

[0053] Cab-O-Sil® M5 2

[0054] 3. Polysulfone thermoplastic adhesive

[0055] Component Parts (weight)

[0056] Polysulfone (molecular weight = 20,000) 95

[0057] Titanium dioxide 5

[0058] 4. Combined epoxy / phenoxy adhesives (combination of thermosetting and thermoplastic)

[0059] Component Parts (weight)

[0060] EPON828 45

[0061] Phenoxy PKHJ 45

[0062] Dicy CG1400 3

[0063] Talc 5

[0064] carbon black 2

[0065] 5. Combine...

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PUM

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Abstract

Electronic packages that consist of dies sealed within hollow plastic enclosures with electrically conductive leads penetrating the enclosure walls to access the die circuitry are manufactured by applying a heat-curable adhesive to the leads at only those locations where the surfaces of the leads will interface with the enclosure material, molding the package around the leads, and curing the adhesive during the molding process or during a post-cure. The adhesive is formulated to form a gas-tight seal around the leads and to maintain the seal during the thermal cycling that the components are exposed to during the typical procedures involved in manufacturing the packages and in making the electrical connections to other circuitry, as well as the typical environmental changes that the finished and installed product is exposed to during use. In particular, the adhesive is selected to accommodate differences in the coefficients of thermal expansion between the leads and the enclosure material while still maintaining a vapor-tight seal.

Description

[0001] The invention belongs to the field of electronic packaging. The invention includes placing the integrated circuit chip in a hollow casing which protects the integrated circuit chip from environmental influences, and forming a connection with the chip circuit by wires outside the casing. The present invention relates in particular to enclosures generally acting as a barrier against the penetration of moisture and polluting gases. background of the invention [0002] The electronic assembly acts as a protective housing for the chip while connecting the chip's circuitry to circuitry on a carrier or substrate such as a printed wiring board. The modules to which the present invention relates are hollow bodies which completely enclose the wafer and are initially formed as open sockets with conductive wires or "scores" embedded in the walls. Once the socket is formed with the wires embedded in the wall, the die is placed in the socket and connected to the wires. The receptac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/08H01L23/28H01L23/10H01L23/31H01L23/50
CPCH01L2924/0002H01L23/3142H01L21/56H01L2924/00H01L23/08H01L23/10H01L23/28H01L23/31H01L23/50
Inventor R·J·罗斯C·L·罗斯T·B·谢弗J·Q·倪
Owner RJR POLYMERS