Bendable semiconductor cooling and heating bands

A semiconductor, bending technology, used in refrigerators, refrigeration and liquefaction, lighting and heating equipment, etc., can solve problems such as inflexibility, and achieve the effect of wide application range and obvious heating effect.

Inactive Publication Date: 2003-04-16
胡兴起
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the defect that the prior art cannot bend, and provide a bendable semiconductor refrigeration, heating

Method used

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  • Bendable semiconductor cooling and heating bands
  • Bendable semiconductor cooling and heating bands
  • Bendable semiconductor cooling and heating bands

Examples

Experimental program
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Embodiment Construction

[0009] The present invention is composed of a cold strip 1, a hot strip 2 and metal bismuth-selenium-antimony alloy particles 3 connected in series in the intermediate phase. Insulation between the foil and the metal sheet, the production process is as follows: degreasing the surface of pure aluminum (copper, iron), and then carrying out anodized surface chemical treatment, adjusting the epoxy glue, and applying epoxy glue on the surface, then in 100 ℃-180℃ for sealing and drying treatment, laminate FR-4 glass fiber tape for insulation, and then apply electrolytic copper foil on the glass fiber (single layer) tape. Copper foil 4 is rectangular and is evenly distributed horizontally and vertically along the cold and hot zones 1 and 2 . The optimal length of the copper foil 4 is 10mm-30mm, and the interval is 0.5mm-1mm. The metal bismuth-selenium-antimony alloy particles connected in series with the intermediate phase of the present invention and the cold and hot-tropical weldi...

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PUM

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Abstract

The invented is composed of the cold belt, hot belt and the cascaded granules of bismuth, selenium, stibium alloy in middle. The cold belt and hot belt are made of the flexible and radiating sheet metal of copper, aluminium and iron with the copper foil being appleid. The copper foil is insulated with the said sheet metal. The copper foils in rectangle shape are distributed evenly along the landscape orientation and the portrait orientation of the cold belt and hot belt. In the on position, the belt can be bent in the entire wide range without damage. The effect for producing cool or heat is obvious. The difference in temperature reaches to more than 30 deg.C. The product can be utilized to prepare the cold or worm caps or the cold or worm fans.

Description

technical field [0001] The invention relates to a semiconductor refrigeration and heating assembly, in particular to a bendable semiconductor refrigeration and heating belt. Background technique [0002] Semiconductor refrigeration (heat) technology is composed of metal materials composed of bismuth antimony selenium alloy chemical elements. The current refrigeration and heating components are composed of solid flat plates and series-connected semiconductor particles, which cannot be bent and deformed, and the driving current is too large, which limits their application in many high-tech fields. Contents of the invention [0003] The object of the present invention is to overcome the defect that the prior art cannot be bent, and provide a bendable semiconductor refrigeration and heating belt. [0004] The present invention is realized through the following scheme: it is composed of metal bismuth-selenium-antimony alloy particles connected in series with a cold band, a hot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02
Inventor 胡兴起
Owner 胡兴起
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