Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micromechanism and its manufacture

A technology of micro-mechanics and micro-mechanical components, applied in the field of multi-layer micro-mechanical devices, can solve problems such as difficulty in obtaining a high quality factor, process quality degradation, etc., achieve high accuracy, reduce process loss, and simple process

Inactive Publication Date: 2003-05-14
SENSONOR
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This makes the pressure in the cavity higher than the base pressure of the connection chamber, and is unpredictable, causing the overall process quality to decrease, down to the fact that devices manufactured by anodic bonding process require considerable control circuits to compensate for the manufacturing variation of their quality factor Q.
This gas evolution also means that it is difficult to obtain a high quality factor Q when the chamber pressure is not as low as required

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micromechanism and its manufacture
  • Micromechanism and its manufacture
  • Micromechanism and its manufacture

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] refer to figure 1 , the connecting chamber 1 in which the method of the invention is carried out is maintained at a controlled low pressure or vacuum by means of a pump (not shown) connected to the outlet 2 and the pressure gauge 3 . The components of the device to be produced are arranged in this chamber 1 . In this embodiment, the device is a resonant accelerometer or gyroscope.

[0023] The components in the connection chamber 1 include a first and a second encapsulation layer 4 . These layers are formed from glass, silicon or silicon sputtered from glass. Formed on the surface of one of the encapsulation layers 4 is a metal layer 5 which provides a detection circuit for the end product of the process. Formed on the other encapsulation layer 4 are one or more getter components fabricated from titanium or other suitable getter material. Located between the two encapsulation layers 4 is a silicon layer 7 which is processed to form device components 8 thereon.

[0...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for producing a multi-layer, micro-mechanical device. The device comprises an internal cavity having a micro-mechanical component therein. The method comprises the steps of forming the micro-mechanical component from a layer of first material, providing a sealing layer on at least one surface of the first material to define the cavity, providing a getter material within the cavity, sealing the first material to the sealing layers by anodic bonding, supplying an inert gas to the cavity to regulate the pressure inside the cavity. A corresponding device produced by the method is also disclosed.

Description

technical field [0001] The present invention relates to the field of multilayer micromechanical devices such as resonant accelerometers or micromachined gyroscopes. Background technique [0002] In order to avoid possible problems, it is desirable to be able to adjust the physical characteristics of such devices. For example, a high quality factor (Q) is usually required for such devices. However, resonators with a very high quality factor Q are vulnerable to damage from external vibrations and shocks, which can cause unwanted vibration modes. This adjustment can be achieved by controlling the pressure within the enclosure defining the cavity of the device. To reduce this pressure, the devices need to be individually packaged and sealed under vacuum or low pressure. However, vacuum packaging a single sensor is a costly process, so it is not suitable for high-volume low-cost production. [0003] It has been observed that variations due to process also have an effect on th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01P15/08B81B3/00B81B7/00B81C3/00G01C19/00
CPCB81C2203/031B81C1/00285B81C2203/0109G01C19/00
Inventor H·哈比比N·赫登斯蒂尔纳
Owner SENSONOR
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com