164 results about "Manufacturing variation" patented technology

A general method is described for producing an inexpensive touchscreen system that provides accurate positional information and compensates for manufacturing variations without complicated sensor arrangements. Utilizing a set of sensed signals that are unique to each location on the touchscreen sensor, equations for X and Y are derived via curve fitting methods. The coefficients of the equations are stored with the sensor. During touchscreen operation the coefficients are used to calculate X and Y to the desired accuracy directly and independently.

There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a compensated microelectromechanical oscillator, having a microelectromechanical resonator that generates an output signal and frequency adjustment circuitry, coupled to the microelectromechanical resonator to receive the output signal of the microelectromechanical resonator and, in response to a set of values, to generate an output signal having second frequency. In one embodiment, the values may be determined using the frequency of the output signal of the microelectromechanical resonator, which depends on the operating temperature of the microelectromechanical resonator and/or manufacturing variations of the microelectromechanical resonator. In one embodiment, the frequency adjustment circuitry may include frequency multiplier circuitry, for example, PLLs, DLLs, digital/frequency synthesizers and/or FLLs, as well as any combinations and permutations thereof. The frequency adjustment circuitry, in addition or in lieu thereof, may include frequency divider circuitry, for example, DLLS, digital/frequency synthesizers (for example, DDS) and/or FLLs, as well as any combinations and permutations thereof.

An ambient light sensor 10 and a backlight sensor 9 are located on the liquid crystal panel 6 adjacently to each other, for correcting a variation of an output characteristic of the ambient light sensor 10. This location keeps the manufacturing variation of each liquid crystal panel 6 even in these two light sensors 9 and 10. A degree of variation of an output of the backlight sensor 9 for sensing a ray of backlight from a backlight module relative to a predetermined reference value is detected. Based on the detected result, the output of the ambient light sensor 10 is corrected. This operation makes it possible to improve sensing accuracy of the ambient light sensor 10 and keep the light modulation even in each liquid crystal panel provided with the ambient light sensor 10.

A load indicating member is provided with a permanent identifying mark which can be read and used to determine ultrasonic measurement parameters specific to the load indicating member to provide more precise and more reliable load measurements by compensating for differences resulting from manufacturing variations in individual load indicating members. The parameters specific to the load indicating member can be stored in coding applied to the load indicating member or in a database that can be accessed remotely, for example, using the Internet.

A semiconductor device has a first semiconductor region formed in a semiconductor substrate and having a first conductivity type due to first-conductivity-type active impurities contained in the first semiconductor region, and a second semiconductor region formed between the first semiconductor region and the surface of the semiconductor substrate and having a second conductivity type due to second-conductivity-type active impurities contained in the second semiconductor region. The second semiconductor region contains first-conductivity-type active impurities whose concentration is zero or smaller than a quarter of a concentration of the second-conductivity-type active impurities contained in the second semiconductor region. An insulating film and a conductor are formed on the second semiconductor region. Third and fourth semiconductor regions of the second conductivity type are formed at the semiconductor surface in contact with the side faces of the second semiconductor region. This semiconductor device is capable of suppressing net impurity concentration variations as well as threshold voltage variations to be caused by a short channel effect or manufacturing variations.

Disclosed is a method, system, and computer program product for implementing model-based floorplanning, layout, placement, and routing. Models are used to guide the placement and routing of polygons on the IC layout based upon predictions of manufacturing variations.

A circuit element the presence of the circuit element includes first and second capacitor plates disposed over the surface of the substrate in an aligned relationship with each other. The aligned relationship has manufacturing variations in the relative positioning of the first and second capacitor plates and a dielectric layer disposed between the first and second capacitor plates. At least one of the first and second capacitor plates is formed substantially smaller relative to the other of the first and second capacitor plates. The at least one of the capacitor plates is disposed at a predetermined offset in at least one planar direction from an edge of the other of the first and second capacitor plates. The predetermined offset is selected according to the manufacturing variations to prevent variations in the value of capacitance of the capacitor due to the manufacturing variations.

Method, apparatus and computer programs are described for compensating for the effect of temperature on the sensitivity of electrostatic ultrasound (US) transducers, particularly as used in an automotive occupancy sensing (AOS) systems for sensing the nature or type of occupant and the location of the occupant with respect to the vehicle interior. The invention permits the AOS to classify the occupancy state of the vehicle from a US echo signal substantially free of the effects of temperature on signal amplitude. A capacitive divider or voltage monitor is employed to measure the capacitance of the transducer. The voltage monitor output is used by the scaling algorithm of a compensator to determine the scaling factor to be applied to the US transducer signal to compensate for the effect of temperature on the transducer sensitivity. Calibration procedures and software are disclosed for determining the coefficients of the scaling algorithm to compensate for temperature effects and also to compensate for installation factors, transducer manufacturing variations, and circuit board effects. The system disclosed is useful for other types of signal processing in addition to temperature compensation of AOS ultrasonic signals, and may be used in other ranging devices such as cameras, golf or binocular range finders, and measuring devices and instruments.

To provide an electronic circuit, an element substrate, an electronic device, an electro-optical device, and an electronic apparatus, which make it possible to perform a precise controlling operation even if manufacturing variations occur, a circuit formation area is an annular formation area of a pixel of a display panel, and does not include a substantially central portion of the pixel. A light emission area is provided in the substantially central portion. One drive circuit is formed in the circuit formation area, and four organic elements OLED are formed in the light emission area. The drive circuit and the organic elements OLED are connected parallel to each other with wirings.

A system wherein already-existing computing and memory resources in an electronic camera are used to process an image for printing. Rather than duplicating, in printers, computing and memory resources that are already in digital cameras, significant computing and memory resources need exist only in the camera. A digital camera can support many different printers, each with its own set of parameters such as for example print size, pixel size, colorimetry, sensitometry, and artifacts compensation. Printer parameters are uploaded from the printer to the camera to provide a basis for image processing specific to the associated printer; whereby compensation may be done for variations in the printer characteristics which may occur as a result of printer manufacturing variations, and further so that compensation may be done for different media types which may be installed in the printer.

The inventions presented herein provide a electronically controlled phase shifters that incorporate analog and digital phase shift architectures in a novel manner that realizes the best advantages of each architecture. This combination of complementary phase shift architectures provides the high-performance and low loss characteristics of switched digital phase shift architectures with the high resolution and precision of continuous analog phase shift architectures. The circuit embodiments are electronically controlled, which simplifies implementation of what is a complex circuit. The analog phase shift elements comprise electronically-tuned varactors, which provide fine resolution and enables the incorporation of active compensation for manufacturing variation before use or for environmental conditions during use.

A load indicating member is provided with an identifying element which can be accessed and used to determine ultrasonic measurement parameters specific to the load indicating member to provide more precise and more reliable load measurements by compensating for differences resulting from manufacturing variations in individual load indicating members. The parameters specific to the load indicating member can be stored in coding applied to the load indicating member or in a database that can be accessed remotely, for example, using the Internet.

A system wherein already-existing computing and memory resources in an electronic camera are used to process an image for printing. Rather than duplicating, in printers, computing and memory resources that are already in digital cameras, significant computing and memory resources need exist only in the camera. A digital camera can support many different printers, each with its own set of parameters such as for example print size, pixel size, colorimetry, sensitometry, and artifacts compensation. Printer parameters are uploaded from the printer to the camera to provide a basis for image processing specific to the associated printer; whereby compensation may be done for variations in the printer characteristics which may occur as a result of printer manufacturing variations, and further so that compensation may be done for different media types which may be installed in the printer.

A temperature detector circuit using a MOS transistor capable of reducing manufacture variation of a mobility and realizing stable output characteristics which are not affected by temperature dependency may be offered. In one example, the temperature detector circuit includes a pair of depression type transistors to output a voltage which is proportional to temperature from a connecting point of a source of a first transistor and a drain of a second transistor. The transistors are the same conducted type of current and are formed in different channel size, which are connected between power supplies in series, and have a configuration in which first transistor's gate and source are connected each other and a first transistor's drain is connected with a second power supply and second transistor's gate and drain are connected each other and a second transistor's source is connected with a first power supply.

The invention relates to the diagnosis of faults and damage in a gearbox in order to predict the operational life of a gearbox. An end of line test is performed to infer information on each gearbox on the production line. A highly detailed model of the gearbox is created to determine the optimal sensor positions for the end-of-line test so that the test can discriminate between different types of manufacturing variation. This information is then used to construct a unique, highly detailed model for each gearbox. During operation, forces and moments acting on the gearbox are measured at regular intervals and the model is used to continuously update a prediction of the total damage on each gearbox component. The probability of failure in a given time period is then calculated. An existing condition monitoring system approach such as vibration analysis may be used in parallel with the model-based diagnosis. The overall probability of failure for a required lifetime is calculated and, if necessary, operation is limited to provide a required probability of failure in a given time period.

There is provided a photoelectric conversion apparatus capable of obtaining good photoelectric conversion characteristics regardless of a decrease in current amplification ratio of the phototransistor and manufacturing variations in phototransistor. The photoelectric conversion apparatus includes a photoelectric conversion element that generates a current by photoelectric conversion; a transistor that inputs a current generated by the photoelectric conversion element to a base thereof, amplifies the input current, and outputs the amplified current from an emitter; a logarithmic conversion unit that logarithmically converts the current output from the transistor; a current generating unit that outputs the current to the base of the transistor; and a current controlling unit that controls the output current of the current generating unit in a light shielding state of the photoelectric conversion element based on the signal logarithmically converted by the logarithmic conversion unit.

Semiconductor integrated circuit apparatus and electronic apparatus having a leakage current detection circuit where arbitrarily set leakage current detection ratio does not depend on power supply voltage, temperature, or manufacturing variations, and where leakage current detection is straightforward. Semiconductor integrated circuit apparatus extracts a stable potential from the center of two NchMIS transistors, amplifies drain current of an NchMOS transistor taking this potential as a gate potential to a current value of an arbitrary ratio using current mirror circuit, makes this current value flow through NchMOS transistor with the gate and drain connected, and applies drain potential of this NchMOS transistor to the gate of leakage current detection NchMOS transistor.

In a method for determining a design parameter in a product design parameter determination supporting system, interaction between product function and design parameter is structured, a design parameter group with reduced interaction is extracted, an experiment design is prepared based upon the design parameter group, modeling of a quality influence degree between product function and design parameter is performed from an experiment result, and coordination process of a design parameter and estimation of a product function are performed with taking into account a manufacturing variation. By this means, it is possible to realize a system which can determine many design parameters extremely efficiently even in the product development where there are many design parameters and product functions to be handled and interactions are present between the design parameters and product functions.

A temperature detection circuit that can detect temperature with high accuracy regardless of manufacturing variations, and a method of adjusting the same. The circuit includes: first and second diodes having respective independent p-n junctions; a first current path including a first variable voltage dividing resistor series connected to the first diode; a second current path including a second variable voltage dividing resistor series connected to the second diode; a reference voltage generation part that feeds back a differential voltage to each of the first and second current paths and outputs as a reference voltage the differential voltage indicating a difference between a first divided voltage of the first variable voltage dividing resistor and a potential on the second current path; and a temperature detection signal generation part generating a temperature detection signal based on a second divided voltage of the second variable voltage dividing resistor.