Method and System for Model-Based Routing of an Integrated Circuit

Abstract

Disclosed is a method, system, and computer program product for implementing model-based floorplanning, layout, placement, and routing. Models are used to guide the placement and routing of polygons on the IC layout based upon predictions of manufacturing variations.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The invention is a continuation-in-part of U.S. application Ser. No. 11 / 648,150, filed on Dec. 29, 2006, which is hereby incorporated by reference in its entirety.BACKGROUND AND SUMMARY[0002]The invention is directed to a more efficient approach for implementing floorplanning, layout, placement, and routing of integrated circuit designs.[0003]A semiconductor integrated circuit (IC) has a large number of electronic components, such as transistors, logic gates, diodes, wires, etc., that are fabricated by forming layers of different materials and of different geometric shapes on various regions of a silicon wafer.[0004]Many phases of physical design may be performed with computer aided design (CAD) tools or electronic design automation (EDA) systems. To design an integrated circuit, a designer first creates high level behavior descriptions of the IC device using a high-level hardware design language. An EDA system typically receives the high...

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Benefits of technology

[0010]Variations in feature density, widths, and heights may also occur during the CMP and plating processes. Variations based upon CMP and plating process are often caused by oxide loss, dishing, erosion, or other copper losses. For ECD, the goal is to completely fill an etched trench region in a void-free manner while minimizing a variation in the deposited copper thickness and minimizing a variation in surface topography. There may exist pattern-dependencies in ECD that result in plated surface variation. Film thickness variation in CMP processes can be separated into various components: lot-to-lot, wafer-to-wafer, wafer-level, and die-level. Often, the most significant component is the pattern dependent die-level component. Die-level film thic

Problems solved by technology

However pattern dependencies between the process by which the ICs are fabricated and the pattern that is being created often cause processed films to have significant variation in thickness across a surface, resulting in variation in feature dimensions (e.g. line widths) of ICs that are patterned using the mask.

Variations based upon CMP and plating process are often caused by oxide loss, dishing, erosion, or other copper losses.

There may exist pattern-dependencies in ECD that result in plated surface variation.

As successive non-conformal layers are deposited and polished, the variation becomes worse.

The variations may lead to numerous problems and flaws in a manufactured IC, such as timing failures, decreased performance, and increased power consumption.

As just one example, because interconnect lines and connections on higher layers carry power to portions of the chip, the variations can increase the sheet resistance and thus affect the

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