Application method of outer lead pin joining backfold welding heat insulating material

Abstract

A method for using the heat insulating material on reflexed welding of outleading pin binding (OLB) is disclosed, which can prevent the overheat damage of electroluminescence elements (LE) or LCD on PCB as it can prevent said LE or LCD from absorbing too high heat when they are welded onto PCB.

Description

technical field [0001] The present invention relates to a method of using an external lead bonding (OLB) reflex welding heat insulating material, in particular to achieve a heat resistance and heat dissipation effect through a heat insulating material, so that it does not affect the welding process after the end of the use method. The use of components such as EL (Electo Luminescence) or LCD (Liquid Crystal Display) on the circuit substrate can increase the quality of product yield and provide technology used in the industry. Background technique [0002] There are many materials such as barrier and heat dissipation on the existing circuit substrate, but their main performance demands are to quickly take away or isolate the excessive heat absorbed by the conductor component itself from the component, so that the EL (Electo Luminescence) or Precision components such as LCD (Liquid Crystal Display) themselves do not cause faulty operation, delay, burnout, etc. due to excessive...

AI Technical Summary

Problems solved by technology

[0002] There are many barrier and heat dissipation materials on the existing circuit substrate, but the main performance demands are to quickly take away or isolate the excessive heat absorbed by the conductor component itself from the component, so that the EL (Electo Luminescence electroluminescence) or LCD (Liquid Crystal Display) and other precision components themselves will not cause erroneous actions, delays, burns, etc. due to excessive accumulated heat, which will cause a product loss

[0003] However, the general existing heat-resistant and heat-insulating materials include: thick paper, asbestos, Teflon, PCB and other materials, or components such as EL (Electo Luminescence Electroluminescence) or LCD (Liquid Crystal Display) are elevated, etc. method, but none of the above materials and methods can achieve a good heat insulation and heat dissipation effect, and may even accelerate the shortening of the service life of the circuit substrate or the electronic component itself

[0004] For example, the cost of thick paper is the cheapest among the above-mentioned heat insulation materials, but paper is combustible. Although it has a heat insulation effect, the heat dissipation of thick paper is worse than that of metal materials, and it absorbs heat from the welding head for a long time. The heat may be too high to cause damage to components such as EL (Electo Luminescence Electroluminescence) or LCD (Liquid Crystal Display)

[0005] Another example is the use of a single Teflon material, which is a polytetraethylene polymer product, and its main feature is a heat-resistant material. Although the Teflon material can have a long-term heat-resistant effect, it should The heat resistance of the material is not as good as that of the PCB material, and if it is exposed to the high temperature of the solder joint for a long time, it will easily cause a bending deformation, and scratches or damage the circuit structure of the circuit substrate to cause short circuits and open circuits. Moreover, the deformed Teflon material cannot return to a flat state, resulting in material waste

[0006] In addition, although an asbestos material can absorb the thermal effect generated during the welding process, the material itself is too soft, so it is sandwiched between the welding head and the components to be welded such as EL (Electo Luminescence Electroluminescence) or LCD (Liquid Crystal Display), It is easy to have incomplete soldering of the circuit board

[0007] In addition, if only a single PCB (glass fiber) board is used, it still cannot solve the thermal impact on the components themselves during soldering due to the advantages of high thermal conductivity and fast heat dissipation of metal. Using air convection to dissipate the heat, this method may have a slow effect, because the air convection speed is slower than that of metal, it will inevitably increase the design of the circuit substrate space, and increase the time required for a complete process

[0008] This shows that above-mentioned existing article still has many shortcomings, is really not a good design, and urgently needs to be improved

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