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Semiconductor storage device

A storage device, semiconductor technology, applied to DRAM. field, which can solve the problem of inaccessibility of virtual arrays

Inactive Publication Date: 2003-08-27
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the first memory cell array can be accessed through the B port, but the virtual array cannot be accessed
[0005] In the semiconductor memory device of the above-mentioned prior art, the dummy array provides only the reference bit line group with respect to the bit line group of the adjacent memory cell array.

Method used

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  • Semiconductor storage device
  • Semiconductor storage device
  • Semiconductor storage device

Examples

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Embodiment Construction

[0034] figure 1 A configuration example of a semiconductor memory device (DRAM) according to the present invention is shown. figure 1 The DRAM includes a 2Tr1C memory cell array 10 and an adjacent end memory cell array 20. Between the 2Tr1C memory cell array 10 and the 2Tr1C memory cell array not shown in the figure, a first bit line open-type sense amplifier circuit 31 is arranged, The 2Tr1C memory cell array 10 and the end memory cell array 20 are provided with a second bit line open type sense amplifier circuit 32, and the end memory cell array 20 is placed on the opposite side of the second bit line open type sense amplifier circuit 32 Bit line folding type sense amplifier circuit 33. When n is an arbitrary integer, the first bit line open type sense amplifier circuit 31 and the B port bit line groups BLb(n-1) to BLb(n+2), and the B port auxiliary bit lines paired therewith Groups BLXb(n-1)~BLXb(n+2) are connected. The second bit line open type sense amplifier circuit 32 an...

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Abstract

To increase utilizable memory capacity by utilizing the conventional dummy array in a semiconductor memory device having open bit line structure for data storage. A bit line folding type sense amplifier circuit 33 is provided at the outer side of an end part memory cell array 20 in which 2Tr1C type cells constituted of a data accumulating capacitor 3, an A port access transistor 4a, and a B port access transistor 4b are constituted in a matrix state, and word lines for selecting a cell are connected to gates of corresponding transistors 4a, 4b. A drain of the A port access transistor 4a is connected to any bit line of a bit line open type sense amplifier circuit 32, and a drain of the B port access transistor 4b is connected to any bit line out of the pair of bit line of the bit line folding type sense amplifier circuit 33.

Description

Technical field [0001] The present invention relates to a semiconductor storage device, in particular to a DRAM (dynamic random access memory). Background technique [0002] A 2-port DRAM cell is disclosed in US Patent No. 5,923,593. According to this patent, a DRAM cell is a 2-transistor·1 capacitor (2Tr1C) type cell composed of two access transistors and one data storage capacitor. If the two ports used to access the data storage capacitor in the DRAM cell are called A port and B port, the above two access transistors are called A port access transistor and B port access transistor, respectively. The A-port access transistor includes a source connected to one electrode of the data storage capacitor, a gate connected to the A-port word line, and a drain connected to the A-port bit line. The B port access transistor includes a source connected to the same electrode of the data storage capacitor, a gate connected to the B port word line, and a drain connected to the B port bit lin...

Claims

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Application Information

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IPC IPC(8): G11C11/401G11C11/405G11C11/4097
CPCG11C11/405G11C11/4097
Inventor 贞方博之
Owner PANASONIC CORP
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