Substrate binding device and method

Abstract

The present invention relates to an improved excellent substrate laminating apparatus and method, which are good for manufacturing liquid crystal display panel. For the vacuum pumping performing of a chamber (2), the opening of a valve (8a) communicating with a vacuum pump (82) is controlled to change the intake resistance of a pipe (81) from high to low, and to suppress an exhaust air stream occurring when vacuum pumping is started. Furthermore, in the process (vacuum venting) for recovering the atmosphere pressure in the chamber (2), a recovery valve (9a) is controlled to change from high to low, the inflow resistance of a gas introduced into the chamber (2), so that the amount of the gas introduced into the chamber (2) at the beginning of the vacuum venting is reduced. Therefore, since the air stream in the chamber (2) can be moderated during the vacuum pumping and the vacuum venting, the stirring up of dust in the chamber (2) and the attachment of the dust to the substrates can be avoided, and high-quality laminated substrates can be provided at a high manufacturing yield.

Description

technical field [0001] The present invention relates to the improvement of an excellent substrate bonding device and substrate bonding method suitable for manufacturing liquid crystal display panels and the like. Background technique [0002] Liquid crystal display panels used in displays such as personal computers, TV receivers, and various monitors are generally produced by bonding a pair of opposing glass substrates together with an adhesive applied around the display surface. [0003] A liquid crystal display panel is formed by encapsulating liquid crystals in the display surface between two bonded substrates. There are two types of liquid crystal injection and liquid crystal drop in liquid crystal encapsulation in the display surface. Regardless of the encapsulation method of liquid crystals, a plurality of spacers are scattered or even installed on any one of the substrates, and bonding is carried out after maintaining a constant interval (cell gap) between substrates ...

AI Technical Summary

Problems solved by technology

[0020] Although the cleanliness of the manufacturing site is as high as possible, it is practically impossible to make the dust and dust contained in the air completely zero, and since the substrate bonding device includes mechanically movable parts, from the mechanism Partial generation of new dust, etc. is inevitable, so it is often impossible to remove such dust and dust trapped in the chamber

[0021] Moreover, when the substrates are bonded, when the vacuum pump is started to evacuate the chamber 2, the rapid exhaust action at the start of the vacuum pump operation will disturb the airflow in the chamber 2, so that dust and dust trapped in the lower chamber 2b will fly. , the risk of being attached to the display surface of the substrate 1b

[0022] Moreover, the adhesion of dust and dust on the substrate after bonding also tends to degrade the electrical characteristics of the substrate

When the vacuum after bonding in the chamber 2 is broken, the airflow for restoring the air pressure will also cause dust and dust in the chamber 2 to fly, adhere to the electrode surface, and damage the electrical conduction with the connected IC, etc.

[0023] Moreover, the requirements for the display screen are becoming more and more refined nowadays, even if there is extremely small dust and dust in the chamber, it will fly up due to the airflow generated when the vacuum is vacuumed or broken, and it will adhere to the display surface and the electrode part, reducing the manufacturing cost. Yield, and thus want to improve

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