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Radiator by utilizing its shield

A radiator and shield technology, applied in the field of heat sinks, can solve problems such as small space of heat sinks, and achieve the effect of reducing heat dissipation

Inactive Publication Date: 2003-09-03
HEWLETT PACKARD CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, the problem facing the design engineer is to remove the excess heat added while allowing the heat sink to take up less space

Method used

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  • Radiator by utilizing its shield
  • Radiator by utilizing its shield
  • Radiator by utilizing its shield

Examples

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Embodiment Construction

[0017] Embodiments of the invention will now be described in detail, examples of which are illustrated in the accompanying drawings. While the invention has been described in conjunction with these Examples, it should be understood that the invention is not limited to these Examples. On the contrary, the present invention is intended to cover alterations, modifications and equivalents of these embodiments, which are included within the spirit and scope of the present invention as defined by the appended claims. Furthermore, in the following detailed description of the invention, numerous specific details are set forth in order to provide a thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to unnecessarily obscure the present invention.

[0018] ...

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Abstract

In one embodiment, the present invention is a heat sink apparatus comprising a heat sink device and a heat sink shroud. The heat sink device is for transferring heat from a heat source. The heat sink shroud is thermally coupled with the heat sink device. Hence, the heat sink shroud transfers heat from the heat sink device and dissipates the heat generated by the heat source.

Description

technical field [0001] The invention relates to the field of heat sinks. More specifically, embodiments of the present invention relate to heat sinks using heat shields. Background technique [0002] The performance reliability and life expectancy of electronic equipment are related to the temperature of the components of the equipment. As device temperatures increase, device reliability and life expectancy decrease exponentially. Accordingly, designers attempt to increase component reliability and life expectancy by effectively controlling the operating temperature of the device. [0003] As the density of integrated circuit (IC) chips increases, the amount of heat generated by the IC chips also increases. Excess heat generated by the IC chip needs to be removed in order to ensure proper operation. More specifically, excess heat can burn and destroy IC chips if not removed. Technology trends are driving IC designs towards higher power IC chips, which emit more and more...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/427
CPCH01L2924/0002H01L23/427H01L23/3675H01L2924/00
Inventor H·米亚穆拉C·G·马洛尼
Owner HEWLETT PACKARD CO
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