Connection structure of distribution substrate and its display device

Abstract

A connection structure of a wiring substrate and a display device, wherein a TFT substrate and a source GS substrate are provided to intersect with the source bus and the source output bus through an insulating film relative to the source bus and the source output bus formed on each substrate. The provided panel-side spare wiring and driver-side spare wiring are also connected to the panel-side spare wiring and driver-side spare wiring along with the connection of the above-mentioned source bus and source output wiring. Thereby, it is possible to easily correct the connection failure of the wiring between the wiring boards to be connected while suppressing the occurrence of the secondary failure.

Description

technical field [0001] The present invention relates to a connection structure of a wiring board used when mounting a drive circuit board on a display panel in active matrix display devices such as liquid crystal display devices, organic EL display devices, and inorganic EL display devices. Background technique [0002] At present, in active matrix display devices such as liquid crystal display devices, the connection between the display panel and the driving circuit for driving the display panel adopts the TCP (Tape Carrier Package) method, the COG (Chip on Glass) method, and a single chip using low-temperature polysilicon technology. way etc. [0003] Such as Figure 11 As shown, in the TCP method, a plurality of gate TCP103 and source TCP105 are connected to the display panel 101, wherein the gate TCP103 is equipped with a gate IC (Integrated Circuit) 102 as a gate signal line driving circuit, and the source TCP105 mounts source IC104 as a source signal line drive circui...

AI Technical Summary

Problems solved by technology

When the GOG method is applied to a large model, the size of the drive circuit side substrate becomes larger (when applied to a 15” class model, the length of the long side of the substrate is about 300mm), so it is easy to peel off the drive circuit side substrate Problems such as cracking of the drive circuit side substrate or display panel side substrate occurred

[0017] In addition, even if there is only one defective connection part, the entire drive circuit side board must be replaced, and a single TCP cannot be replaced like the TCP method.

[0018] In addition, as a method of correcting poor connection caused by foreign matter, a method of cutting the foreign matter by laser irradiation can also be considered. However, conductive foreign matter usually has a thickness of several tens of μm, and the foreign matter can only be broken through the glass substrate without damaging the electrode terminal. , it is technically difficult to

[0019] As mentioned above, especially in the GOG system, due to the increase in the incidence of poor connection, the difficulty of correction work, the damage of the display panel caused by correction errors, the increase in man-hours, the increase in the cost of repair parts, and the occurrence of secondary defects during correction Occurrence and degradation of quality will become a problem

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