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Insulation material for printed circuit board and method for making printed circuit board by same

A technology for printed circuit boards and insulating materials, which is applied in multilayer circuit manufacturing, printed circuit components, and secondary treatment of printed circuits. It can solve problems such as poor flatness of copper foil, achieve good surface coating effects, reduce The effect of adhesion

Inactive Publication Date: 2003-10-22
ETERNAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Another object of the present invention is to provide a method of using the above-mentioned insulating material to manufacture a multilayer printed circuit board, which can improve the flatness of the insulating layer, so that the problem of poor flatness of the copper foil of the circuit board can be solved, thereby improving the circuit board. Yield of board fine lines

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0028] Experimental steps:

[0029] (1) Add the metered epoxy resin, hardener, toughening agent, filler and solvent into a container with a stirrer, then stir and dissolve at room temperature, then add the accelerator and stir evenly, and finally filter and statically Place and defoam to make a resin composition (see the following table 1 for its composition).

[0030] (2) Place the PET carrier film (see Table 2 below for the type of carrier film) face up on the coating machine, and adjust the scraper so that the thickness of the resin composition coating is 60 um. The carrier film coated with the resin composition was baked in an oven at 140°C for 10 minutes. The purpose of this step was to remove the solvent and half-cure the resin (B-stage). The thickness of the dry film was 40um.

[0031] (3) Paste the carrier film on the browned copper foil substrate, place it in a vacuum press, press at 110°C with a pressure of 1Kgf for 1 minute, and cause the resin to undergo a cross-l...

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PUM

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Abstract

The present invention relates to an insulation material used for making printed circuit board with multilayer as the material contains a base material with specific property and a resin compotise with specific property.

Description

technical field [0001] The invention relates to an interlayer insulating material applicable to a multilayer printed circuit board, and a method for using the insulating material to manufacture a multilayer printed circuit board. Background technique [0002] In the past, the more commonly used method for manufacturing multilayer printed circuit boards was the thermal pressure build-up method using a prepreg sheet as an insulating adhesive layer. This method includes first preparing an insulating core material with a circuit pattern on it, The insulating core material is composed of epoxy resin, hardener, glass cloth, etc., and includes blind vias or through holes. Then, a prepreg sheet made of glass cloth impregnated with epoxy resin was used as an insulating layer on the circuit pattern, and the insulating layer was bonded to the blackened copper foil and the circuit pattern using heat and pressure. In the above-mentioned known prepreg hot-pressing layer-up method, since ...

Claims

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Application Information

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IPC IPC(8): C09J163/00H05K1/02H05K3/38H05K3/46
Inventor 陈彦达梁魁文许再发
Owner ETERNAL MATERIALS CO LTD
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