Insulation material for printed circuit board and method for making printed circuit board by same

A technology for printed circuit boards and insulating materials, which is applied in multilayer circuit manufacturing, printed circuit components, and secondary treatment of printed circuits. It can solve problems such as poor flatness of copper foil, achieve good surface coating effects, reduce The effect of adhesion

Inactive Publication Date: 2003-10-22
ETERNAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Another object of the present invention is to provide a method of using the above-mentioned insulating material to manufacture a multilayer printed circuit board, which can improve th

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0027] Example

[0028] Experimental steps:

[0029] (1) First add the measured epoxy resin, hardener, toughening agent, filler and solvent into a container with a stirrer, then stir to dissolve at room temperature, then add the accelerator and stir evenly, and finally filter and statically Set and defoam to prepare a resin composition (see Table 1 below for its composition).

[0030] (2) Place the PET carrier film (for the types of carrier film in Table 2 below) with the front side facing up, and place it on the coating machine platform, and adjust the doctor blade to make the resin composition coating thickness of 60um. The carrier film coated with the resin composition is baked in an oven at 140° C. for 10 minutes. The purpose of this step is to remove the solvent and make the resin semi-cured (B-stage). The thickness of the dry film is 40 μm.

[0031] (3) Stick the carrier film on the copper foil substrate whose surface has been browned, place it in a vacuum laminator, and pre...

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PUM

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Abstract

The present invention relates to an insulation material used for making printed circuit board with multilayer as the material contains a base material with specific property and a resin compotise with specific property.

Description

technical field [0001] The invention relates to an interlayer insulating material applicable to a multilayer printed circuit board, and a method for using the insulating material to manufacture a multilayer printed circuit board. Background technique [0002] In the past, the more commonly used method for manufacturing multilayer printed circuit boards was the thermal pressure build-up method using a prepreg sheet as an insulating adhesive layer. This method includes first preparing an insulating core material with a circuit pattern on it, The insulating core material is composed of epoxy resin, hardener, glass cloth, etc., and includes blind vias or through holes. Then, a prepreg sheet made of glass cloth impregnated with epoxy resin was used as an insulating layer on the circuit pattern, and the insulating layer was bonded to the blackened copper foil and the circuit pattern using heat and pressure. In the above-mentioned known prepreg hot-pressing layer-up method, since ...

Claims

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Application Information

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IPC IPC(8): C09J163/00H05K1/02H05K3/38H05K3/46
Inventor 陈彦达梁魁文许再发
Owner ETERNAL MATERIALS CO LTD
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