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Case for packaging optical device and making method thereof

A technology of optical devices and manufacturing methods, applied in laser parts, lasers, semiconductor lasers, etc., can solve the problems of affecting light transmittance, long production cycle, high cost, reduce assembly workload, improve cost performance, and shorten production cycle Effect

Inactive Publication Date: 2003-10-29
FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO LTD +1
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AI Technical Summary

Problems solved by technology

However, this method of using glue to bond the fixed glass sheet 161 to the housing opening 12 needs to be heated and baked, and the glass sheet 161 needs additional processing to meet the ideal optical requirements, and its production cycle is relatively long. The process is cumbersome and mass production cannot be realized, so the cost of this packaging method is high; and there may be glue overflow during the manufacturing process, which will contaminate the glass sheet 161 and affect the light transmission; in addition, the light-transmitting window 16 obtained by this method The structure of the laser device 10 is prone to failure under external impact or high temperature environment, thus causing the structure to loosen, thereby affecting the overall performance of the laser device 10

Method used

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  • Case for packaging optical device and making method thereof
  • Case for packaging optical device and making method thereof
  • Case for packaging optical device and making method thereof

Examples

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Embodiment Construction

[0017] The optical device packaging cover and its manufacturing method of the present invention include the steps of providing a casing and an optical lens (described in detail later), please refer to figure 2 and Figure 6 As shown, the optical package 40 includes a housing 20 and an optical lens 31 . The casing 20 has a flat top 21 and an annular bottom plate 22 . The casing 20 is integrally formed and roughly shaped like a pot. Wherein the flat top 21 has a through optical lens mounting portion 23 , and the optical lens mounting portion 23 includes a light-transmitting opening 231 and a channel opening 232 . In addition, the ring-shaped bottom plate 22 is a brim-shaped ring-shaped bottom plate extending outward from the bottom end of the housing 20 along the edge of the housing, so that the encapsulating cover is compatible with the base (not shown) on which the optical device is placed when packaging the optical device (not shown). ) can be closely matched. The housing...

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PUM

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Abstract

An encapsulating casing of optical device is prepared through providing a case able to contain optical device and an optical lens, mounting the optical lens to the light transmission window on the top of said case, loading them in a mould, filling the heated transparent plastics with a certain viscosity in the mould until it flows to the mounting position of optical lens, and cooling to inlay theoptical lens in said window.

Description

【Technical field】 [0001] The invention relates to an optical device encapsulation cover and a manufacturing method thereof, and is applied to a semiconductor laser device and a light detection device in a light emitting module or a light receiving module in the field of light transmission. 【Background technique】 [0002] With the continuous development of society, the application fields of optical devices are gradually expanding, and the laser device as a light source is also developed correspondingly, which usually includes a laser diode and a light detection diode. Since both the laser diode and the light detection diode are relatively fragile, external mechanical shock and humidity can make their performance unstable. In order to protect the laser diode and the light detection diode, the laser diode and the light detection diode usually need to be packaged. [0003] Generally, the packaging and method of existing laser devices include: providing a base, the surface of th...

Claims

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Application Information

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IPC IPC(8): G02B6/42H01S5/00
Inventor 黄楠宗
Owner FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO LTD
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