Multi-chip package and producing method thereof
A technology of multi-chip packaging and packaging, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., and can solve problems such as inapplicability to high-speed device products, difficulty in stacking, and increased area of multi-chip packaging
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no. 1 example
[0051] A multi-chip package according to a first embodiment of the present invention is shown in image 3 and Figure 17 Perspective and cross-sectional views in . refer to image 3 and Figure 17 , the multi-chip package 100 includes four chips 111, 112a, 112b and 113 (see Figure 11 to Figure 13 ). Three sides of the multi-chip package 100 are surrounded by a circuit substrate 120 , and all semiconductor chips 111 , 112 a , 112 b , and 113 are placed in an inner space 102 of the package defined by an inner surface of the circuit substrate 120 . Each of the semiconductor chips 111 , 112 a , 112 b , and 113 has a plurality of chip bumps 88 formed on its upper surface and physically bonded and electrically connected to the inner surface of the circuit substrate 120 .
[0052] The circuit substrate 120 includes three regions in total. The circuit substrate 120 is folded at the boundaries of these areas; the first area 121 forms an upper surface of the package, the second a...
no. 3 example
[0070] Figure 19 to Figure 22 A multi-chip package 300 and steps of its manufacturing method according to the third embodiment of the present invention are shown, wherein Figure 19 is a plan view of the inner surface of the unit circuit substrate 320, Figure 20 is a plan view of a unit circuit substrate 320 on which semiconductor chips 311, 312a, 312b, and 313 are mounted, Figure 21 is a perspective view of the unit circuit substrate 320 in a folded state, and Figure 22 It is a perspective view showing a state of filling the sealant 340 into the internal space of the package.
[0071] As shown in the figure, different from the previous embodiments, the circuit substrate 320 includes four regions 321 , 322 , 323 and 324 . In particular, the fourth area 324 extends from one side of the third area 323 and is formed in a plug-in socket type. The external connection terminals of the package are a plurality of contact pads 350 formed on one side of the fourth region 324 . ...
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