Image sensor assembly and its mfg. method
Patent Information
- Authority / Receiving Office
- CN Β· China
- Current Assignee / Owner
- SAMSUNG ELECTRO MECHANICS CO LTD
- Publication Date
- 2003-12-24
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
technical field
[0001] The present invention generally relates to camera modules applied to digital cameras, and more particularly, to image sensor modules and methods of manufacturing the same. Background technique
[0002] As is well known to those of ordinary skill in the art, recently, digital cameras have been widely used for Internet images and communications. In particular, as next-generation mobile communication terminals are widely used for PDAs (Personal Digital Assistants) and IMT-2000 (International Mobile Telecommunications 2000), demands for compact camera modules have increased. For example, small mobile communication terminals are being increasingly used for audio-visual communication on the Internet. In other words, there is a great demand for slim camera modules for producing digital cameras with improved functions.
[0003] In particular, it is expected that a PDA terminal will be used as a multimedia device using various external devices such as a camer...