Flexible wiring boards for double-side connection

A wiring board, double-sided technology, applied in the field of flexible wiring boards for double-sided connection, can solve the problems of loss of smoothness, contamination, and reduced reliability of circuit substrates, and achieve the effect of high-efficiency manufacturing

Inactive Publication Date: 2004-01-07
DEXERIALS CORP
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] That is, as shown in FIG. 5(a) and FIG. 5(b), in the case of a conventional flexible wiring board 101 for double-sided connection, for example, a liquid crystal having an electrode pattern 107 formed on a glass substrate 106 When the board 108 is thermocompressed, since the anisotropic conductive adhesive 104 will bulge inward through the hole 102a, it will lose its smoothness or be stained, and the reliability of the connection with another circuit substrate will decrease. The problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible wiring boards for double-side connection
  • Flexible wiring boards for double-side connection
  • Flexible wiring boards for double-side connection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Hereinafter, preferred embodiments of the flexible wiring board for double-sided connection of the present invention will be described in detail with reference to the drawings.

[0030] Figure 1a ~ Figure 1e It is a process drawing which shows the manufacturing method of the flexible wiring board for double-sided connection of this embodiment.

[0031] Such as Figure 1a As shown, first, a laminated body 1 is prepared, and the laminated body is provided with first and second copper foils (metal foils) 21 and 22 on both surfaces of, for example, a polyimide film (insulating base material) 10 .

[0032] Next, if Figure 1b As shown, holes 21 a are formed in predetermined positions of the first copper foil 21 by etching with an etchant such as copper chloride, persulfates, ferric chloride, and copper-amine chromium compounds.

[0033] Such as Figure 1c As shown, the exposed portion of the polyimide film 10 is etched with an etchant such as an alkaline solution such a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention provides a flexible wiring board for double-side connection capable of improving the reliability of connection to circuit boards and a manufacturing process thereof. A flexible wiring board for double-side connection 30 of the present invention comprises a polyimide film 10 having a through-hole 10a at a given location and first and second electrodes 31, 32 provided on both sides of the polyimide film 10. The second electrode 32 is provided to close one end of the through-hole 10a in the polyimide film 10. The first and second electrodes 31, 32 are electrically connected each other by a plating layer 23.

Description

technical field [0001] The present invention relates to, for example, a double-sided connection flexible wiring board for electrically connecting a liquid crystal panel and a circuit board, and a method for manufacturing the same. Background technique [0002] In the past, the method of electrically connecting the liquid crystal panel and the electrical substrate was to adopt this method, that is, between the electrodes formed on the liquid crystal panel and the connection part formed on the circuit substrate, anisotropic conductive rubber, and mechanically crimp them. [0003] In recent years, in order to improve the conduction reliability between the connection terminals of the liquid crystal panel and the circuit board, double-sided flexible wiring boards having through holes have been used instead of anisotropic conductive rubber. [0004] Figure 4 It is a cross-sectional view showing the structure of main parts of a conventional double-sided connection flexible wiring...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11G02F1/1345H05K1/14H05K3/32H05K3/36H05K3/42H05K3/46
CPCH05K2201/0394H05K2201/09509H05K3/462H05K3/323H05K3/427H05K2201/10378Y10T29/49165H05K2203/0554H05K3/361H05K3/421H05K2201/09827Y10T29/49167H05K2203/0455H05K2201/09472H05K1/14
Inventor 岸本聪一郎安西幸雄庆野修
Owner DEXERIALS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products