Micro-powder remover

Abstract

An object of the present invention is to provide an apparatus for removing particles which effectively eliminates particles in the vacuum container unit without degrading the rate of operation of the processing device, and is simple and inexpensive to embody. <??>The apparatus for removing particles in accordance with the present invention is for a processing device including a vacuum container unit having a plurality of chambers in which a predetermined process is performed on a wafer carried in by a conveyer unit in atmosphere. The apparatus comprises a charge neutralizing means for neutralizing charges generated on a surface of the wafer, the charge neutralizing means being mounted in a waiting-accommodation unit which constitutes a part of the conveyer unit, and a charging means for adsorbing particles in the vacuum container unit by electrostatic force, the charging means being mounted in the vacuum container unit.

Description

technical field [0001] The present invention relates generally to an apparatus for removing particles, and more particularly to an apparatus for removing particles for processing equipment including a vacuum container unit in which a wafer A predetermined process is carried out on the wafer, and the wafer is carried by the transfer unit. As a processing apparatus to which the present invention is applied, there is a sputtering apparatus used for manufacturing electronic devices such as semiconductor integrated circuits and liquid crystal panels. Background technique [0002] As electronic devices such as semiconductor integrated circuits and liquid crystal display panels become larger in size and their processing techniques become more microscopic, particles, such as dust in the air and fine grains in liquid chemicals during the manufacturing process, greatly significantly affect the characteristics or productivity of electronic devices. For this reason, the elimination of...

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Problems solved by technology

Moreover, since the Totsukuda charging electrode is in contact with the particle collection plate for charging, the surface of the particle collection plate is damaged due to scratches, resulting in additional particle generation

[0007] Furthermore, since the mechanism for moving the charging rod is installed through the wall of the vacuum vessel, the device for charging the particle collection tray is complex and bulky and requires high assembly costs

Also, it is more expensive to operate due to the use of expensive gas used to aid combustion to dry clean

[0008] In addition, since the film preparation process must be stopped for a long time when the particle collection tray absorbs particles, the operating rate is reduced

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