Manufacturing method of circuit device
A manufacturing method and circuit device technology, which is applied in the direction of printed circuit manufacturing, circuit, printed circuit, etc., can solve the problems of large position deviation between layers, unsuitable multi-layer wiring structure, deformation, etc.
Inactive Publication Date: 2004-05-19
SANYO ELECTRIC CO LTD +1
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
This is because the flexible board is very soft, so it deforms before and after the patterning of the conductive film, and the positions of the laminated layers are large, and there is a problem that it is not suitable for a multilayer wiring structure.
Method used
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Embodiment Construction
[0040] The manufacturing method of the circuit device of the present invention includes the following steps: preparing the substrate 10 on which the first conductive film 11 and the second conductive film 12 covering one main surface of the first conductive film 11 are laminated; The conductive film 12 is covered with a desired pattern and a photoresist layer PR having a slope 13S inclined to the opening 13; conductive wiring is selectively formed in the opening 13 of the photoresist layer PR. layer 14, and form a reverse slope 14R around the conductive wiring layer 14; use the conductive wiring layer 14 as a mask to remove the second conductive film 12; fix the semiconductor element 17 on the first conductive film On the film 11, the electrode of the semiconductor element 17 is electrically connected to the prescribed conductive wiring layer 14; the semiconductor element 17 is covered with a sealing resin layer 21, and the reverse side of the conductive wiring layer 14 The in...
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Abstract
Priorly, semiconductor devices wherein a flexible sheet with a conductive pattern was employed as a supporting substrate, a semiconductor element was mounted thereon, and the ensemble was molded have been developed. In this case, problems occur that a multilayer wiring structure cannot be formed and warping of the insulating resin sheet in the manufacturing process is prominent. In order to solve these problems, a laminated plate 10 formed by laminating a first conductive film 11 and a second conductive film 12 is covered with a photoresist layer PR having opening portions 13 with inclined surfaces 13 S, a conductive wiring layer 14 is formed in the opening portions by electrolytic plating to form inverted inclined surfaces 14 R, and then, when covering the same with the sealing resin layer 21 , an anchoring effect is produced by making the sealing resin layer 21 bite into the inverted inclined surfaces 14 R so as to strengthen bonding of the sealing resin layer 21 with the conductive wiring layer 14.
Description
technical field [0001] The present invention relates to a method of manufacturing a circuit device, and more particularly to a method of manufacturing a thin circuit device using a conductive wiring layer having a reverse slope at a periphery having an anchoring effect. Background technique [0002] In recent years, the adoption of IC components in mobile devices or small, high-density mounting equipment is progressing, and conventional IC components and their mounting concepts are undergoing major changes. For example, it is disclosed in JP-A-2000-133678. This is a technique related to a semiconductor device using a polyimide resin board which is a flexible board as an example of an insulating resin board. [0003] Figure 10 ~ Figure 12 It is a diagram using a flexible board 50 as an inter-po-za substrate. In addition, the upper figure in each figure is a plan view, and the lower figure is an A-A line sectional view. [0004] First, in Figure 10 The upper surface of t...
Claims
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IPC IPC(8): H01L23/12H01L21/56H01L23/31H01L23/48H01L23/538H05K1/18H05K3/06H05K3/10H05K3/20H05K3/28
CPCH01L24/97H05K3/108H05K1/187H05K3/062H05K3/284H01L23/3128H01L21/566H05K1/185H01L2924/15311H05K3/205H05K2201/098H01L2224/48091H01L23/538H01L2224/73265H01L2224/49171H01L2224/45144H01L2924/07802Y10T29/49146Y10T29/49169Y10T29/49156Y10T29/49171H01L2924/00014H01L2924/00H01L23/48
Inventor 五十岚优助水原秀树坂本则明
Owner SANYO ELECTRIC CO LTD