Solid-state photographic device and equipment using the photographic device

Abstract

The present invention provides a small, high-performance imaging device and its application to products at low cost by preventing noise superimposed on a timing pulse feed line from affecting the output of an imaging chip. The imaging device includes two chips: an imaging chip (101) including a sensor (102) and an image processing chip (106) including an image processing circuit (110). The transistors of all circuits in the imaging chip (101) are formed as either nMOS or pMOS transistors. The imaging chip (101) is stacked on the image processing chip (106).

Description

technical field [0001] The present invention relates to a small solid-state imaging device used in a mobile phone and a small device using the solid-state imaging device. The solid-state imaging device can achieve a high level of three aspects of ultra-small size, low cost, and high performance. Background technique [0002] In recent years, small imaging devices that can be incorporated in small devices such as cellular phones have been developed. The conditions that this kind of imaging device should have are, first, ultra-small size, and second, low cost, and because a common CMOS process is used in logic LSI, it is easy to connect with peripheral circuits, and CMOS is used for cost reduction. Sensors have gone mainstream. In addition, the CMOS sensor and the logic part can be integrated into one chip, so it can be integrated into a single chip with the image processing part, and ultra-miniaturization can be realized. Figure 6 Shown is the structure of an existing singl...

AI Technical Summary

Problems solved by technology

If the wiring that controls the switch is located outside the chip, since the wiring itself is superimposed on the noise, or the pulse transmitted through the wiring is delayed, the unstable noise of the power supply caused by the above-mentioned through current increases.

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