Polyimide film, mfg method and application
A technology of polyimide film and polyamic acid, applied in chemical instruments and methods, coatings, layered products, etc., can solve difficult and unclear problems
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
preparation example Construction
[0092] The organic solvent used in the preparation of the polyamic acid solution, that is, the polymerization solvent used in the polymerization of the polyamic acid, is not particularly limited as long as it dissolves the polyamic acid. As a specific example, amide-based solvents, namely N-N-dimethylformamide, N-N-dimethylacetamide, N-methyl-2-pyrrolidone, etc. can be mentioned. Even among these, N-N- Dimethylformamide, N-N-dimethylacetamide. These organic solvents are usually used alone, but they can also be used in combination of two or more as needed.
[0093] In addition, the composition of the polyamic acid solution is not particularly limited, but the polyamic acid is preferably dissolved in an organic solvent in an amount of 5 to 35% by weight, most preferably 10 to 30% by weight. In such a range, a suitable molecular weight and solution viscosity can be obtained.
[0094] Fillers may be added to the above-mentioned polyimide film for the purpose of improving various...
Embodiment 1
[0143] In 407.5 g of N,N-dimethylformamide (DMF), 21.98 g of 4,4'-hydroxydiphenylamine (ODA) and 7.91 g of p-phenylenediamine (PDA) were dissolved, and the solution was kept at 0°C. To this solution, 29.47 g of 3,3'-4,4'-benzophenonetetracarboxylic dianhydride (BTDA) was gradually added, stirred for 1 hour, and BTDA was completely dissolved. Slowly add 25.15g p-phenylene bis(trimellitic monoester anhydride) (TMHQ) in this solution, after stirring for 1 hour, add 7.98g pyromellitic dianhydride (PMDA) again, stir for 1 hour hours, a polyamic acid solution having a solution viscosity of 3000 poise at 23° C. and a solid content concentration of 18.5% by weight was obtained. Table 1 shows the mol % of the monomer components added at this time. In Table 1 and Table 3 described later, the monomer compositions are described from the top to the bottom in the order of adding the monomers.
[0144] A curing agent consisting of 11.4 g of acetic anhydride, 4.8 g of isoquinoline, and 33.8...
Embodiment 2
[0147] 17.90 g of ODA and 9.67 g of PDA were dissolved in 407.5 g of DMF, keeping the solution at 0°C. 28.81 g of BTDA was slowly added to this solution, and stirred for 1 hour to completely dissolve BTDA. After slowly adding 24.59 g of TMHQ to this solution and stirring for 1 hour, 11.52 g of BTDA was added and stirred for 1 hour to obtain a polyamic acid solution having a solution viscosity of 2800 poise at 23° C. and a solid content concentration of 18.5% by weight. Table 1 shows the mol % of the monomer components added at this time. In addition, in Table 1, the mol% of BTDA is 50 and 20, and represents the amount of BPDA added first and BPDA added later.
[0148] Except having used this polyamic-acid solution, it produced similarly to Example 1, and obtained the polyimide film and TAB tape of thickness 50 micrometers. Table 2 shows the properties of the polyimide film and the TAB tape.
PUM
| Property | Measurement | Unit |
|---|---|---|
| elastic modulus | aaaaa | aaaaa |
| elastic modulus | aaaaa | aaaaa |
| water absorption | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More