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Computer system and method for cooling computer system

A computer system, cooling medium technology, applied in computing, cooling/ventilation/heating retrofit, instruments, etc., to solve problems such as failure of electronic modules or electronic components

Inactive Publication Date: 2004-10-13
吴善萍 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the power supply and the disk drive will also generate a lot of heat, which may cause an electronic module or electronic component to fail

Method used

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  • Computer system and method for cooling computer system
  • Computer system and method for cooling computer system
  • Computer system and method for cooling computer system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] figure 1 It is a schematic front view of a photo pattern of a computer system 10 according to the present invention, wherein the computer system 10 includes a casing 12 and a plurality of modules 14 . The module 14 can be detached from the housing 12 by sliding. Module 14 can be assembled in the following device under the preferred situation:

[0053]1. Computer modules, such as standard ATX / Micro ATX motherboards, two 3 1 / 2-inch hard drives, and one or two high-speed processors.

[0054] 2. The storage module, for example, can support six standard 3 1 / 2-inch hard disks.

[0055] 3. The communication module, for example, can support multiple communication components.

[0056] 4. The control module, for example, can support multiple industrial controller components.

[0057] Each module 14 preferably includes the following features:

[0058] 1. The tool-less thumbscrew module can be locked in the housing.

[0059] 2. Front accessible power switch.

[0060] 3. The ...

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PUM

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Abstract

A computer system and a method for cooling the system incorporate removable modules within a housing. The housing includes a parallelepiped structure with at least four walls. The four walls include at least two sets of opposing walls. Both walls of one set of opposing walls include opposing first and second openings substantially aligned with each other to allow passage of a cooling medium therethough. The module is receivable through a third opening in the parallelepiped structure and includes an electrical component region. The housing includes a first airflow path in-line with the third opening and a second airflow path between the first opening and the second opening. The first airflow path and the second airflow path are directed across the component region of the module when the module is received within the housing.

Description

technical field [0001] The present invention relates to a stand-alone or case-connected housing having a computer module into which the computer module or blade can be inserted in a sliding manner, and in particular to a A housing that utilizes dual airflow paths to cool components such as computer modules. Background technique [0002] Cooling computer systems has been a long-standing problem. As microprocessor energy dissipation and system energy consumption continue to increase, the cooling system design needs to be considered when affected by the size of the housing and the size of the hot-swappable components or when improving the reliability of the customer service network system issues, and in particular issues related to temperature monitoring and control. Advanced servers utilize high power multiple processors, thus generating excessive heat within the system. [0003] Basically, the microprocessor and related electronic components can be cooled by supplying air,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H05K7/20
CPCH05K7/20727G06F1/20
Inventor 吴善萍吴善华
Owner 吴善萍
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