Method for testing power type LED thermal resistance and special purpose chip thereof

A technology of LED chips and special chips, which is applied in the field of accurate measurement of thermal resistance characteristics of power LED devices, can solve the problems of complicated operation, reduced R&D cost, high price, etc., so as to reduce manufacturing cost, reduce testing cost, and facilitate operation. Effect
CN1544954AInactive Publication Date: 2004-11-10FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
Publication Date
2004-11-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention is a method of testing thermal resistance of power LED and its special chip, its main character: using special chip to simulate the designed power LED chip, they have the same structure of extension layer and electrode layer, when using it to make the power LED to be tested, also adopting the same or similar packaging technique to the designed power LED. It can accurately simulate the thermal working characteristic of the designed power LED, by testing and calculating, obtains the thermal resistance without adopting expensive special testing instruments, reducing the development cost of power LEDs.
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Description

technical field

[0001] The invention relates to a technique for accurately measuring the thermal resistance characteristics of a power LED device during the process of designing or improving the power LED. Background technique

[0002] Power LED, that is, power light-emitting diode, its input power is several times, tens of times, or even hundreds or even thousands of times that of ordinary LEDs. In order to dissipate the heat generated by power LEDs in a timely manner, ensure The working temperature of the power LED is within the allowable range, so that the power LED can work with high efficiency and high reliability for a long time, and the power LED device is required to have a small thermal resistance, which requires the design or improvement of the power LED package In the process of structure, packaging material, and packaging process, the thermal resistance of power LEDs is continuously measured, and the impact of new designs or improvements on thermal resistance is ...

Claims

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