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7 results about "Small pulse" patented technology

Flow chamber assembly, optical detection system and sample analyzer

The invention relates to the technical field of in vitro diagnosis, and discloses a flow chamber assembly, an optical detection system and a sample analyzer, the flow chamber assembly comprises a mounting seat and a flow chamber; the mounting seat is provided with a rotary adjusting structure, and the rotary adjusting structure is used for arranging the flow chamber on a base of the optical detection system in a left-right rotating manner; the flow chamber is used for enabling to-be-detected particles of a detected sample to pass through one by one so as to generate scattered light capable of being used for detection under laser irradiation of the optical detection system. The flow chamber rotates left and right on the base of the optical detection system, so that the angle of the flow chamber assembly in the left-right direction can be adjusted, the angle of reflected light generated when a laser beam is propagated in a light path is further adjusted, and the purpose that the reflected light of laser cannot enter a laser is achieved; the problem that the detection precision is affected by small pulses generated by power peaks generated when reflected light enters a laser is solved.
Owner:SHENZHEN DYMIND BIOTECH

Systems and methods for controlling operation of inverter for electric vehicle

A system includes: an inverter including a first switch and a second switch; one or more controllers configured to control the inverter by performing operations, the operations including: generating a minimum pulse width value for a first pulse-width modulated (PWM) signal to control the first switch and for a second PWM signal to control the second switch; determining that an on-time pulse to be generated for the first PWM signal will be less than or equal to the minimum pulse width value for a period based on a first deadtime configuration; and in response to the determining: determining a second deadtime configuration for the first PWM signal and the second PWM signal for the period; and generating the first PWM signal and the second PWM signal based on the second deadtime configuration, to prevent the on-time pulse that is less than or equal to the minimum pulse width value.
Owner:BORGWARNER US TECHNOLOGIES LLC

Inverter wave sealing method and inverter wave transmission recovery method and system

The invention relates to an inverter wave sealing method, an inverter wave transmission recovery method and an inverter wave transmission recovery system. The inverter wave sealing method comprises the following steps: setting a first time delay, and continuously detecting a driving signal and a wave sealing signal of an inverter; after it is detected that the wave sealing signal is triggered, a target phase triggering wave sealing is determined, the target phase is immediately subjected to wave sealing, and other non-triggering wave sealing phases normally emit waves; the first switching tube of the non-triggering wave sealing phase is naturally switched off after the falling edge is ended, so as to stop generating the rising edge, and a first delay is started; and after the first time delay is finished, the second switch tube of the non-triggering wave sealing phase is turned off. According to the invention, the target phase and the non-trigger wave sealing phase for triggering wave sealing are classified, the target phase adopts immediate wave sealing, and the non-trigger wave sealing phase adopts natural turn-off of the first switching tube and does not interrupt the normal beat of the non-trigger wave sealing phase, so that the non-trigger wave sealing phase can be prevented from generating small pulse width due to sudden wave sealing, the risk of failure of the power module is effectively reduced, and the reliability of the power module is improved. And the overall operation stability and safety of the inverter are improved.
Owner:SINENG ELECTRIC CO LTD

A method and system for determining a cross-scale bridge of femtosecond laser process parameters

This application discloses a method and system for determining cross-scale bridges of femtosecond laser process parameters. By establishing a local response library containing small pulse memory states at the nanoscale, and then mapping the local removal response at the nanoscale to the macroscopic pit shape at the micrometer scale through convolutional epitaxy, a quantitative cross-scale correlation can be established between the atomic-scale microscopic removal mechanism captured by dual-temperature-molecular dynamics and the micro-pit morphology and processing mode at the experimental scale without performing full-scale, full-pulse molecular dynamics brute-force calculations. This preserves the interpretability of the microscopic mechanism and can directly inversely obtain the equipment process parameters applicable to actual processing, effectively reducing the experimental cost of femtosecond laser process development, solving the long-standing spatial scale breakage problem of TTM-MD, improving multi-pulse prediction capability, and enhancing the ability to inversely obtain process parameters.
Owner:CENT SOUTH UNIV

Laser processing method, apparatus, device, and circuit board

The application relates to a laser processing method, device, equipment and circuit board. The method comprises the following steps: acquiring a processing position of a piece to be processed; controlling a first pulsed laser of a laser processing device to output a first laser beam to the processing position, so that the processing position is melted; and controlling a second pulsed laser of the laser processing device to output a second laser beam to the processing position, so that the molecular bonds of the melted material are broken and removed. The pulse width of the first laser beam is greater than the pulse width of the second laser beam. The piece to be processed is processed in stages by using the laser beam with a larger pulse width and the laser beam with a smaller pulse width: the first laser beam makes the material structure of the piece to be processed easy to process, and the second laser beam breaks the molecular bonds of the material which has become easy to process and removes the material, so that a precise, reliable and relatively smooth processing surface is obtained. Thus, the processing requirements of the circuit board made of new materials such as ceramic substrates and glass substrates can be met, and high processing precision is ensured.
Owner:SHENZHEN DAZU MICROELECTRONICS TECHNOLOGY CO LTD

Design method of high repetition frequency pulse power supply

ActiveCN116722764BAchieve multi-load operationImprove component utilizationPulse power supplyControl theory
The application discloses a design method of a high-repetition working frequency pulse power supply, belonging to the technical field of pulse power technology. The design method comprises the following steps: determining a load working condition, including the pulse current demand and the repetition working frequency of each load; designing a pulse inductor, calculating the equivalent working frequency and the thermal load of the pulse inductor according to the pulse current demand and the repetition working frequency of each load, and optimizing the pulse inductor to meet the temperature rise requirement; designing a thyristor, determining the highest repetition working frequency of a single thyristor, and determining the required number of thyristors for each load; and controlling the discharging time sequence, setting the discharging time sequence of each thyristor to meet the repetition working frequency demand of each load. The application can realize the repetition working frequency operation of the pulse power supply with multiple loads, improve the component utilization rate, reduce the volume of the pulse power supply, reduce the thermal load of a single thyristor through the time-sharing multiplexing of the thyristor, and improve the service life of the thyristor and the system reliability.
Owner:HUAZHONG UNIV OF SCI & TECH