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Method for cutting glass through laser

A laser cutting and glass technology, applied in glass manufacturing equipment, glass cutting devices, manufacturing tools, etc., can solve the problems of damage, prone to chipping, micro-crack delamination, etc., to achieve high precision, smooth cutting quality, The effect of improving cutting efficiency

Inactive Publication Date: 2014-08-06
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The object of the present invention is to provide a method for laser cutting glass, which aims to make up for the deficiencies in the prior art, solve the problems of edge chipping, microcracks and delamination that are easy to occur in the process of cutting glass, and improve cutting efficiency

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  • Method for cutting glass through laser
  • Method for cutting glass through laser
  • Method for cutting glass through laser

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Embodiment Construction

[0022] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0023] Please also refer to figure 1 with figure 2 , the method for laser cutting glass of the present invention comprises the following steps: using a laser 10 with a pulse width ranging from picoseconds to femtoseconds; the laser beam 70 generated by the laser 10 is incident on the inside of the glass workpiece 60 to be cut after focusing processing, The focus 72 of the laser beam 70 is located inside the glass workpiece 60; the laser beam 70 and the glass workpiece 60 are relatively moved according to a preset path, so that the focus 72 is formed in the inside of the glass workpiece 60 by a pl...

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Abstract

The present invention belongs to the field of laser cutting processing, and provides a method for cutting glass through laser, wherein a purpose of the present invention is to solve the problems that edge collapse, micro-cracks, layering and other damages are easily produced during a glass cutting process. The method comprises that: a laser beam produced by a laser with a pulse width range from picoseconds to femtoseconds is subjected to a focusing treatment, and then enters into a glass work-piece requiring cutting, the laser beam and the glass work-piece perform relative movement according to a predetermined path to make the focal point form a cutting layer formed by a plurality of micro-cracking points along the laser beam scanning path in the glass work-piece, and external force is applied to the glass work-piece so as to tear the glass work-piece along the path. According to the method of the present invention, the glass beam is focused in the glass work-piece and the cutting layer is formed in the glass work-piece, and the small pulse width and the extremely low single point energy are adopted to achieve cutting of the glass work-piece so as to obtain the glass work-piece with no cracks and no damage, avoid generation of fine debris, and improve the cutting efficiency.

Description

technical field [0001] The invention belongs to the field of laser cutting processing, in particular to a method for laser cutting glass. Background technique [0002] With the rapid development of electronic products, especially notebook computers, smart phones, liquid crystal displays and tablet computers, etc. are all developing towards thinner volume, lighter weight and lower manufacturing cost. And these electronic products are inseparable from glass sheets. At present, the thickness of glass sheets on electronic products has been reduced from 1.1mm to 0.6~0.7mm, and the glass sheets of mobile phone screens have been reduced to 0.3mm or even lower. The thinner the glass sheet is, the more sensitive it is to the force, and the easier it is to be brittle after being impacted, which undoubtedly increases the difficulty of cutting and processing. [0003] Existing glass cutting methods roughly include mechanical cutting and CO 2 Laser cutting method. The mechanical cutti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/08
Inventor 尹建刚高昆叶树铃李瑜王焱华潘丹高云峰
Owner HANS LASER TECH IND GRP CO LTD
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