Tin cream coating assistant apparatus

An auxiliary equipment and solder paste technology, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve problems such as high failure rate, waste of solder paste, and reduced operating efficiency, and achieve the effect of reducing the failure rate

Inactive Publication Date: 2005-02-23
ASUSTEK COMPUTER INC
View PDF0 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, this way of applying solder paste by supporting the tin planting plate 9 with one hand and holding the scraper with the other hand is easy to cause the tin planting plate 9 to deviate from the tin planting area due to unconscious shaking of the hand or the touch of other things, so that The solder paste 92 is not accurately applied on the SMT solder joint 80
In other words, the failure rate of this method of applying solder paste is quite high, so that the operating efficiency is greatly reduced, and it also causes unnecessary waste of the solder paste 92

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Tin cream coating assistant apparatus
  • Tin cream coating assistant apparatus
  • Tin cream coating assistant apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] exist figure 1 In the preferred embodiment shown, it shows the three-dimensional appearance of a solder paste coating auxiliary equipment, which generally includes:

[0020] A moving device 1 is provided to receive a work object A and adjust the two-dimensional position of the work object A. Wherein, the workpiece A is a circuit board in this embodiment.

[0021] A lifting device 3 is located on one side of the moving device 1 .

[0022] A tin planting device 60 is arranged on the lifting device 3 and its height position can be controlled by the lifting device 3 , and the tin planting device 60 is also provided with a tin planting plate 7 for extending above the workpiece A. Wherein, the tin planting plate 7 is similar to Figure 7 The bottom plate of the shown tin planting plate also has a plurality of through tin planting holes and multiple wall plates.

[0023] Since the moving device 1 can be used to move the tin-planting area where the workpiece A is to be coat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention consists of a mobile device, a lifting and lowering device and a tin transplanting device. The mobile device can provide two dimensional spaces for holding a work piece or adjusting the work piece and the lifting and lowering device can control the height of the tin transplanting device. So the tin transplanting board on the tin transplanting device can be precisely and stably pressed on the working area of the work piece. Further more it makes tin past to be precisely paint on each SMT welding spot.

Description

(1) Technical field [0001] The invention relates to a device that can assist in coating solder paste on a workpiece, especially an auxiliary device for solder paste coating that can greatly reduce the failure rate of solder paste coating. (2) Background technology [0002] Based on the development trend of miniaturization and multi-functionality, many circuit boards have been equipped with a large number of surface mount components (hereinafter referred to as SMT components). In order to assemble these SMT components, while forming the surface conductor pattern on the circuit board, a plurality of SMT solder joints need to be formed for corresponding soldering to each terminal of the SMT component. In many occasions, in order to increase the speed and reliability of soldering, preparatory solder is usually applied to the SMT solder joints. For example, in the case of BGA, the SMT solder joints on the circuit board will be plated with a layer of preparatory solder , so that ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/34
Inventor 朱其全
Owner ASUSTEK COMPUTER INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap