Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate treater and treating method

A substrate processing device and substrate technology, which are applied to the improvement field of adsorption and desorption of substrates on substrate placement parts, can solve problems such as poor substrate processing, achieve high-efficiency adsorption processing, increase adsorption force, and reduce manufacturing costs.

Active Publication Date: 2005-03-09
DAINIPPON SCREEN MTG CO LTD
View PDF2 Cites 34 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, depending on the amount of misalignment, a processing defect of the substrate occurs in the processing unit of the post-process.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate treater and treating method
  • Substrate treater and treating method
  • Substrate treater and treating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0059] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0060] 1. The first form of implementation

[0061] 1.1. The structure of the substrate processing device

[0062] figure 1 It is a perspective view showing an example of the structure of the substrate processing apparatus 1 according to the embodiment of the present invention. In addition, FIG. 2 is a plan view showing an example of the structure of the substrate processing apparatus 1 according to the embodiment of the present invention. In addition, in figure 1 In order to clarify their directional relationship, an XYZ rectangular coordinate system in which the Z-axis direction is the vertical direction and the XY plane is the horizontal plane is given as necessary in order to clarify their directional relationship.

[0063] The substrate processing device 1 is a device for applying a resist to a square substrate W to form a resist film on the surface o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention is to provide a substrate treating device which can satisfactorily attract a substrate to its substrate placing part and, at the same time, from which the substrate attracted to the substrate placing section can be removed satisfactorily even when the size of the substrate is increased. A plurality of adsorption grooves 75 formed on the holding surface of the substrate treating device in a grid-like state are connected to each other at grid points 76. A part of the grid points 76 communicates with suction holes 72. The suction holes 72 are connected to a vacuum pump in communicating states through piping. End-section lifter pins 71a and central-part lifter pins 71b are independently provided in vertically movable states. Consequently, (1) the substrate treating device can attract the whole bottom surface of an angular substrate W even when the device does not have many attraction holes in the holding surface and (2) can attract the angular substrate W to the holding surface from the vicinity of the central part of the substrate W to the end section of the substrate W.

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method for performing predetermined processing on semiconductor substrates, glass substrates for liquid crystal display devices, glass substrates for photomasks, substrates for optical discs, etc. (hereinafter, simply referred to as "substrates"). It is an improvement related to adsorption and desorption of a substrate on a substrate mounting part. Background technique [0002] Conventionally, there is known a substrate processing apparatus that adsorbs a substrate to be processed on a suction plate and performs predetermined processing (for example, Patent Document 1). Also, in the prior art, there is known an apparatus that lifts a square substrate between a processing plate and a substrate delivery position while supporting it with a plurality of fixing pins (for example, Patent Document 2). [0003] Patent Document 1 is JP-A-10-086085, [0004] Patent Doc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23Q3/08B25J15/06H01L21/027H01L21/304H01L21/68H01L21/683
CPCG03F7/16H01L21/6838
Inventor 高木善则水野博喜
Owner DAINIPPON SCREEN MTG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products