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Return device

A technology of reflow device and recovery port, which is applied in the direction of assembling printed circuits, printed circuits, manufacturing tools, etc. of electric components, which can solve the problems of low heating efficiency of the object P to be heated, and achieve good thermal efficiency, improved fluidity, and high cycle efficiency Effect

Inactive Publication Date: 2005-03-09
HIROTERU TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In the reflux device involved in Patent Document 1, the ejection port and the recovery port 2 are too close, because the gas G ejected from the ejection port is not effectively sprayed on the object to be heated P, but is recovered by the recovery port 2, so there is a heated The problem of low heating efficiency of substance P

Method used

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Embodiment Construction

[0025] Refer to Figure 1- Figure 4 The best mode for carrying out the reflux device of the present invention will be described.

[0026] 1 to 3 show a first example of the best embodiment of the reflux device of the present invention.

[0027] The first example shows a reflow device that heats a plate-shaped object to be heated P consisting of a printed circuit board on which electronic components are placed.

[0028] The first example consists of a discharge surface 1, a recovery port 2, a casing 3, a rectifying plate 4, a shroud 5, a heater 6, a blower 7, a partition wall 8, and a drive motor 9.

[0029] The discharge surface 1 is composed of a flat plate material 12 through which a discharge port 11 can pass. The discharge port 11 is composed of a plurality of small holes for discharging the heated gas G. As shown in FIG. The ejection surface 1 is arranged to be opposed to the plate-shaped heated object P that is continuously or intermittently conveyed in a horizontal di...

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Abstract

To uniformly heat entire object surfaces various in size without a reduction in object heating efficiency. A gas discharge surface (1), provided with a multiplicity of gas discharge ports for discharging a heated gas (G), is arranged to face a planar object (P) to be heated, and recovery ports (2) are provided near the gas discharging surface (1) for recovering the heated gas (G) blown onto the planar object (P) to be heated. The recovery ports (2) are arrayed in two lines on the discharge surface (1), one near the middle of the feeding direction of the object (P) and the other near the middle of the widthwise direction of the object (P), with the two lines forming a cruciform.

Description

technical field [0001] The present invention relates to a reflow device for heating a plate-shaped object to be heated composed of a printed circuit board on which electronic components are placed. Background technique [0002] Currently, SMT-type electronic components mounted on a printed circuit board are sent to a reflow device in a state of being placed on the printed circuit board via solder, and are heated by the reflow device to melt the solder to solder leads. As the heating mechanism of the reflux device, the hot air circulation type is often used, that is, the heated air, inert gas and other gases are sprayed on the heated object, and the gas sprayed on the heated object is recovered before heating. [0003] Such as Figure 5 As shown, in a general hot air circulation type reflux device, the ejection surface 1 with a plurality of ejection ports for ejecting the heated gas G is set to be opposite to the plate-shaped heated object P, and the recovered The recovery p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008B23K3/00B23K31/02B23K101/42H05K3/34
Inventor 木村昌博
Owner HIROTERU TECH