Apparatus for inner surface modification by plasma source ion implantation
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- INST OF PHYSICS - CHINESE ACAD OF SCI
- Publication Date
- 2005-07-06
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the ion implantation technology using a plasma source, in particular to a device for modifying the inner surface of the plasma source ion implantation. Background technique
[0002] At present, plasma source implantation (PSII) is a new material surface ion implantation technology, such as in J.Appl.Phys. Such a plasma source ion implantation technique is described in "Plasma sourceion-implantation technique for surface modification of materials" by J.L. Radtke, R.A. Dodd, Frank J. Worzala, and Ngoc C. Tran. But at this time, directly injecting the inner surface of the tubular workpiece with PSII technology cannot be used to treat the inner surface of the pipe with a diameter-to-length ratio of less than 0.6. In order to solve this problem, the applicant proposed a method for modifying the inner surface of a tubular workpiece based on PSII technology in the Chinese invention patent application (publication number: 1382829) pub...